TFC-118-02-LM-D SAMTEC Connector (Other) In Stock
SAMTEC TFC-118-02-LM-D is a 36-position, 0.050-inch (1.27 mm) pitch Tiger Eye cost-effective dual-row terminal strip offering reliable high-density PCB-to-board connectivity. Features low insertion force contacts rated for multiple mating cycles in compact embedded designs. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 36
- Lifecycle
- ACTIVE
- Datasheet
- TFC-118-02-LM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-118-02-LM-D?
- 36-position dual-row Tiger Eye terminal strip at 0.050" (1.27 mm) pitch, enabling ultra-high-density board-to-board or wire-to-board connectivity in space-constrained PCB layouts
- Cost-effective Tiger Eye contact design delivers reliable low-insertion-force mating with consistent electrical performance across hundreds of mating cycles
- Compact 0.050-inch pitch reduces PCB real estate by up to 50% compared to 0.100-inch pitch alternatives, ideal for high-density computing, instrumentation, and embedded systems
What is TFC-118-02-LM-D used for?
TFC-118-02-LM-D is deployed in high-density PCB interconnects for embedded computing modules, test and measurement adapters, and FPGA development boards where 36-position dual-row connectivity at 0.050-inch pitch maximizes signal routing in constrained PCB areas. Its Tiger Eye contact technology provides reliable low-force mating for daughter card and mezzanine board connections that require frequent insertion and removal during prototyping or field servicing. The cost-effective design makes it suitable for high-volume production in consumer electronics and industrial automation equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-118-02-LM-D datasheet?
TFC-118-02-LM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-118-02-LM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does TFC-118-02-LM-D provide, and how compact is its PCB footprint?
TFC-118-02-LM-D provides 36 positions in a dual-row configuration with 0.050-inch (1.27 mm) pitch, giving 18 pins per row. This is half the pitch of standard 2.54 mm connectors, allowing the same 36 pins to occupy approximately half the PCB board space compared to 0.100-inch pitch alternatives.
What is the Tiger Eye contact technology in TFC-118-02-LM-D, and how does it benefit high-cycle applications?
Tiger Eye contacts in TFC-118-02-LM-D use a dual-beam contact design that applies consistent normal force across the mating interface, achieving low and reliable contact resistance even after hundreds of mating cycles. This makes the connector suitable for daughter card and mezzanine board applications that require repeated insertion and removal during development or field servicing.
In which embedded system designs is TFC-118-02-LM-D's 0.050-inch pitch most advantageous over wider-pitch alternatives?
TFC-118-02-LM-D's 0.050-inch (1.27 mm) pitch is most advantageous in FPGA mezzanine cards, high-density test fixtures, and compact embedded CPU modules where routing 36 signals requires minimizing connector footprint. In these designs, the 1.27 mm pitch allows the 36-position dual-row strip to fit in areas that would be impossible with standard 2.54 mm pitch connectors.
How does TFC-118-02-LM-D reduce overall BOM cost in high-volume PCB production compared to premium high-speed connectors?
TFC-118-02-LM-D is positioned as a cost-effective Tiger Eye terminal strip, offering reliable 36-pin dual-row connectivity at 0.050-inch pitch without the premium cost of high-speed or controlled-impedance board connectors. For signal frequencies where impedance matching is not critical — typically below 100 MHz — TFC-118-02-LM-D delivers adequate electrical performance at a lower per-unit cost, reducing total connector spend in high-volume builds.
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