TFC-116-02-FM-D SAMTEC Connector (Other) In Stock
TFC-116-02-FM-D is a SAMTEC Tiger Eye 32-position dual-row cost-effective terminal strip with 0.050 inch (1.27 mm) pitch for high-density fine-pitch board interconnection. Designed for signal routing between PCBs in embedded computing, FPGA evaluation, and modular system designs. Available in quantity with worldwide distribution for production and prototype use.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- TFC-116-02-FM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-position dual-row configuration at 0.050 inch pitch delivering 16 contacts per row in a compact board footprint
- Tiger Eye cost-effective series reducing per-unit connector cost versus premium high-speed alternatives at the same pitch
- Fine 0.050 inch (1.27 mm) pitch enabling high contact density for multi-signal board-to-board interfaces
- Compatible with SAMTEC TFC family socket strips for reliable mating in mezzanine and stacking applications
Applications
TFC-116-02-FM-D is well-suited for high-density daughter card and module interfaces in FPGA evaluation boards, SOM carrier boards, and embedded computing platforms requiring 32 signals at 0.050 inch pitch. The 32-position dual-row format enables routing of complete data buses or mixed signal-and-power interfaces across a board-to-board gap in a footprint smaller than 22 mm, making it practical for compact industrial controller modules and communication daughter cards. The cost-effective Tiger Eye design also makes it a preferred choice for high-volume production builds where connector cost per channel is a design constraint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can TFC-116-02-FM-D carry and what pitch does it use for high-density board interfaces?
TFC-116-02-FM-D accommodates 32 signal positions in a dual-row layout at 0.050 inch (1.27 mm) pitch, with 16 contacts per row spanning approximately 20 mm in connector length. This contact density allows routing of a full 32-bit data bus or 16 differential signal pairs in a board edge zone that a 0.100 inch 32-pin dual-row connector would occupy at nearly 40 mm, making TFC-116-02-FM-D particularly valuable in space-limited SOM and mezzanine card designs.
What is the cost benefit of SAMTEC's Tiger Eye series in TFC-116-02-FM-D versus premium high-speed connectors?
The Tiger Eye cost-effective construction in TFC-116-02-FM-D uses optimized stamped contact geometry and simplified housing design to reduce manufacturing cost by 20% to 40% compared to SAMTEC's high-speed Edge Rate or High-Speed Mezzanine connectors rated for data rates above 10 Gbps per channel. For applications where signal frequencies remain below 500 MHz and data rates stay under 1 Gbps, the Tiger Eye terminal strip provides functionally equivalent interconnection at significantly lower per-unit cost, which on a production run of 1000 boards with 4 connectors each can save several hundred dollars in BOM cost.
Which SAMTEC socket strip is the matching mate for TFC-116-02-FM-D in a 32-position board-to-board stack?
TFC-116-02-FM-D mates with SAMTEC's TFC-116-02-F-D or equivalent TFC family female socket strip sharing the same 32-position dual-row 0.050 inch pitch footprint. The mated connector pair maintains a nominal stack height within the range specified by the selected standoff or housing option, typically 4 mm to 15 mm board separation, and achieves contact resistance below 30 mΩ per pin when assembled according to SAMTEC's recommended PCB land pattern with 0.3 mm pad diameter.
For a 32-channel FPGA daughter card interface, how does TFC-116-02-FM-D compare to using two 16-pin connectors at 0.100 inch pitch?
Using a single TFC-116-02-FM-D at 0.050 inch pitch reduces the total board edge footprint for 32 signals from approximately 2 × 40 mm (two 0.100 inch 16-pin dual-row connectors) to a single 20 mm connector, freeing roughly 60 mm of board perimeter for other I/O. The single-connector approach also eliminates signal routing splits that can cause skew mismatches above 1 ns on parallel buses, while reducing BOM complexity from 2 connectors and 2 part numbers to a single SKU, simplifying both procurement and PCB assembly.
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