TFC-114-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-114-02-LM-D-A-K is a 28-position Tiger Eye dual-row cost-effective terminal strip at 1.27 mm (0.050 inch) pitch with low-profile mating and kinked lead termination. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- TFC-114-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-114-02-LM-D-A-K?
- 28-position dual-row layout at 1.27 mm (0.050 inch) pitch delivers 28 signal channels in a compact low-profile terminal strip
- Tiger Eye contact geometry ensures reliable spring-loaded mating with consistent contact force across all 28 positions
- Kinked (K) lead termination provides self-clinching board retention during solder reflow, reducing connector movement before soldering
- Cost-effective TFC series design offers a lower-BOM-cost alternative to premium socket series without sacrificing basic interconnect reliability
What is TFC-114-02-LM-D-A-K used for?
The TFC-114-02-LM-D-A-K is well-suited for low-cost board-to-board interconnects in consumer electronics, embedded control panels, and small-form-factor computing modules where 28 signal channels are needed at 1.27 mm pitch. The kinked lead design simplifies PCB assembly by holding the strip in place before reflow, reducing manual fixture requirements on production lines. Its Tiger Eye contacts enable reliable mating with corresponding male headers across moderate insertion cycle counts.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-114-02-LM-D-A-K datasheet?
TFC-114-02-LM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-114-02-LM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFC-114-02-LM-D-A-K support and what is its contact pitch?
The TFC-114-02-LM-D-A-K supports 28 positions in a dual-row arrangement at 1.27 mm (0.050 inch) pitch, giving designers 28 independent signal or mixed signal-power channels in a strip that occupies approximately 17.8 mm of PCB length. This density is well-matched to FPGA I/O banks, small microcontroller extension headers, and sensor module interfaces.
What does the K suffix in TFC-114-02-LM-D-A-K indicate and why does it matter for PCB assembly?
The K suffix denotes a kinked lead termination style, meaning the pin tails are mechanically formed with a small bend that press-fits into the PCB pads and holds the connector in place before solder reflow. This self-clinching feature eliminates the need for adhesive or mechanical fixtures during reflow soldering, saving assembly time and reducing placement errors on high-volume SMT production lines handling the 28-pin strip.
How does the TFC-114-02-LM-D-A-K differ from Samtec's SFM series for a board-to-board interconnect design?
The TFC-114-02-LM-D-A-K belongs to the cost-effective TFC terminal strip family optimized for lower insertion-cycle applications where contact gold thickness is reduced to minimize unit cost, whereas the SFM series uses heavier gold plating (30 µin or more) for high-reliability mating exceeding 1,000 cycles. For designs requiring fewer than 200 mating cycles and sensitive to BOM cost per position, TFC offers comparable 1.27 mm pitch density at a lower price per pin.
Can the TFC-114-02-LM-D-A-K be used in an automated tape-and-reel SMT assembly line?
The -A suffix on the TFC-114-02-LM-D-A-K indicates the part is packaged in a tray format rather than tape-and-reel, making it compatible with standard SMT tray feeders used in automated pick-and-place systems. For high-volume production requiring tape-and-reel delivery, Samtec offers TR-suffix variants of the TFC family, but the -A tray version is suitable for batch-mode automated assembly with typical pick-and-place equipment handling 28-position strips at 1.27 mm pitch.
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