TFC-113-02-LM-D-K-TR SAMTEC Connector (Other) In Stock
Samtec TFC-113-02-LM-D-K-TR is a 26-position Tiger Eye dual-row SMD terminal strip with 0.050" (1.27 mm) pitch, rated for 1A per contact and up to 250V, providing cost-effective high-density board-to-board or wire-to-board connectivity in a compact tape-and-reel package.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- TFC-113-02-LM-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-113-02-LM-D-K-TR?
- 26-position dual-row 0.050" (1.27 mm) pitch Tiger Eye terminal strip enabling high-density board-to-board or cable-to-board connections in tight PCB footprints
- 1A per contact current rating at 250V supporting mixed signal and low-power distribution across 26 pins in a single SMD connector
- Tape-and-reel (TR) packaging for automated SMT pick-and-place assembly, reducing placement cycle time in high-volume production
What is TFC-113-02-LM-D-K-TR used for?
The TFC-113-02-LM-D-K-TR is designed for high-density signal interconnects in compact embedded systems, industrial I/O modules, and daughterboard-to-motherboard stacking where 0.050" pitch allows 26 pins in the space that a 0.100" connector would need for only 13 pins. Its cost-effective Tiger Eye construction and tape-and-reel packaging also make it well suited for high-volume consumer electronics and communications equipment assemblies that require repeatable SMT placement and reliable dual-row cable terminations.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-113-02-LM-D-K-TR datasheet?
TFC-113-02-LM-D-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-113-02-LM-D-K-TR?
Compatible alternatives and drop-in replacements for TFC-113-02-LM-D-K-TR:
Board Stacking Connector, 26 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator
Board Connector, 26 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal
Board Stacking Connector, 26 Contact(s), 2 Row(s), Male, Straight, Solder Terminal
Board Stacking Connector, 26 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator
Board Stacking Connector, 26 Contact(s), 2 Row(s), Male, Straight, Solder Terminal
Frequently Asked Questions
How does the 0.050" pitch of the TFC-113-02-LM-D-K-TR compare to standard 0.100" connectors for high pin-count designs?
At 0.050" (1.27 mm) pitch, the TFC-113-02-LM-D-K-TR accommodates 26 positions in approximately the same PCB length as a 13-position 0.100" connector, effectively halving the board footprint for dense signal routing in embedded controllers, industrial backplanes, and communication modules.
What current and voltage rating does each contact of the TFC-113-02-LM-D-K-TR support?
Each of the 26 contacts in the TFC-113-02-LM-D-K-TR is rated for 1A current at up to 250V, making it appropriate for low-power digital signal lines, TTL and LVDS buses, and light power distribution rails where current per pin stays below 1A in mixed signal-power connector applications.
Why choose the tape-and-reel variant of the TFC-113-02-LM-D-K-TR for production assembly?
The TR (tape-and-reel) packaging of the TFC-113-02-LM-D-K-TR is optimized for automated SMT pick-and-place equipment, reducing manual handling errors and increasing placement throughput on high-volume production lines compared to cut-tape or tube packaging, while the SMD termination style enables reflow soldering for consistent solder joint quality across all 26 positions.
In which embedded or industrial designs does the dual-row Tiger Eye layout of this connector provide the greatest advantage?
The dual-row Tiger Eye layout concentrates 26 signal connections into a narrow parallel strip at 0.050" row pitch, making the TFC-113-02-LM-D-K-TR ideal for memory module interfaces, FPGA expansion headers, and industrial I/O boards where 13 pins per row at 1.27 mm intervals enable compact routing alongside fine-pitch BGA components on the same PCB layer.
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