TFC-112-02-LM-D-A SAMTEC Connector (Other) In Stock
SAMTEC TFC-112-02-LM-D-A is a 24-position Tiger Eye dual-row cost-effective terminal strip with 0.050 inch (1.27 mm) pitch, featuring low-profile mounting and gold-plated contacts for reliable signal interconnection. It provides 24 signals in a compact 1.27 mm pitch footprint for SMT board-to-board interfaces. Available from stock worldwide for module, backplane, and embedded computing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- TFC-112-02-LM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-112-02-LM-D-A?
- 24 positions in a dual-row 0.050 inch (1.27 mm) pitch layout offering high signal density in a compact PCB footprint
- Low-profile mounting (LM) variant reducing vertical height above board for space-constrained mezzanine and stacked module assemblies
- Tiger Eye contact design delivering consistent low-resistance mating with gold-plated contacts over multiple insertion cycles
- Cost-effective terminal strip design providing reliable 24-channel interconnection at lower cost than precision-machined contact alternatives
What is TFC-112-02-LM-D-A used for?
The TFC-112-02-LM-D-A is suited to low-profile mezzanine card interfaces in embedded computing, networking, and test equipment where 24 signals must cross between stacked boards with minimal stack height. The 1.27 mm pitch dual-row layout allows high pin density on small module cards used in FPGA evaluation boards, SOM carrier boards, and instrument plug-in cards. Its surface-mount footprint integrates into standard reflow assembly processes supporting automated high-volume production of compact electronics modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-112-02-LM-D-A datasheet?
TFC-112-02-LM-D-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-112-02-LM-D-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile mounting variant of the TFC-112-02-LM-D-A benefit stacked board designs?
The low-profile mounting (LM) variant of the TFC-112-02-LM-D-A reduces the above-board connector height, enabling tighter board-to-board stack heights typically below 4 mm. In a dual-board mezzanine assembly where total Z-height is constrained to 8 mm, this low profile saves 2 mm to 3 mm compared to standard-height 1.27 mm pitch connectors, allowing thicker PCBs or additional passive components between the boards.
How many signals does the TFC-112-02-LM-D-A carry and over what footprint length?
The TFC-112-02-LM-D-A provides 24 positions in a dual-row layout at 0.050 inch (1.27 mm) pitch. With 12 positions per row, the connector body spans approximately 12 × 1.27 mm = 15.2 mm in length, carrying 24 independent signal or power contacts in less than 16 mm of PCB edge — compared to 30.5 mm required for a 24-position 2.54 mm pitch alternative.
What contact finish does the TFC-112-02-LM-D-A use and how does it maintain signal integrity over time?
Tiger Eye series connectors from SAMTEC use gold-over-nickel plating on mating contact surfaces, typically 30 µin gold. This finish prevents oxidation and maintains contact resistance below 20 mΩ after 100 mating cycles and extended storage. The nickel underplate acts as a diffusion barrier preventing gold from alloying with the copper base material, preserving the low-resistance surface over the product's service life.
For a 24-channel SPI and GPIO interface on an FPGA daughter card, how does the TFC-112-02-LM-D-A compare to using two separate 12-pin connectors?
Using the TFC-112-02-LM-D-A as a single 24-position connector reduces the solder joint count by 50% compared to two 12-pin connectors, lowering assembly defect risk. It also eliminates the 2 mm to 5 mm gap between separate connector housings, saving board space. A single mating action connects all 24 SPI, GPIO, and power signals simultaneously, reducing assembly time by approximately 30 seconds per board at typical hand-assembly rates.
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