TFC-111-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC TFC-111-02-F-D is a 22-position Tiger Eye dual-row board stacking connector with 0.050" (1.27 mm) pitch. Gold flash mating contacts with tin-nickel termination provide reliable PCB-to-PCB interconnection in space-constrained embedded and mezzanine board designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Datasheet
- TFC-111-02-F-D Datasheet PDF
- Category
- Connector
- Price
- From $1.1296(MOQ 32)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-111-02-F-D?
- 22-position dual-row board stacking connector at 0.050" (1.27 mm) pitch enables high signal-density mezzanine connections in a compact footprint under 15 mm long
- Gold flash (3 micro-inch) mating contact finish delivers low and consistent contact resistance below 20 mΩ, supporting reliable signal coupling through multiple mating cycles
- RoHS-compliant (Pb-free) construction with tin-nickel barrier termination ensures compatibility with lead-free reflow soldering and green electronics manufacturing requirements
What is TFC-111-02-F-D used for?
The TFC-111-02-F-D is used in mezzanine and daughter-card assemblies for embedded computing modules, FPGA expansion boards, and wireless communication daughter cards where 22 signals must bridge two stacked PCBs at minimal board area. Its 0.050" pitch keeps the connector under 15 mm long while the gold flash mating contacts support the repeated plug-in cycles common in field-upgradeable or development-platform configurations. The lead-free design ensures compliance with RoHS directives in consumer and industrial electronics.
What are the specifications of TFC-111-02-F-D?
| Pbfree Code | Yes |
| YTEOL | 8.65 |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD FLASH (3) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 3.1A |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 22 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TFC-111-02-F-D datasheet?
TFC-111-02-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-111-02-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 22-position dual-row layout of the TFC-111-02-F-D enable mixed signal and power routing in an FPGA daughter card?
With 22 positions in a dual-row configuration at 0.050" (1.27 mm) pitch, designers can allocate 16 pins for a parallel data bus, 2 pins for differential pairs, 2 pins for control signals, and 2 pins for 3.3 V power and ground. This pin budget covers a standard half-width FPGA I/O bank interface in a connector measuring only about 14 mm long, leaving maximum board space for logic circuitry on the daughter card.
What is the mating contact finish on the TFC-111-02-F-D, and how many mating cycles can it reliably support?
The TFC-111-02-F-D uses gold flash (3 micro-inch minimum) on its mating contacts. This gold thickness is suited to moderate mating cycle counts, typically 25 to 50 cycles per SAMTEC Tiger Eye series specifications, which is adequate for development boards, field-upgrade configurations, and daughter cards that are inserted during production test and then remain permanently installed. For applications requiring hundreds of mating cycles, a heavier gold plating variant would be more appropriate.
How does selecting the TFC-111-02-F-D over a higher-count variant like the TFC-117-02-F-D reduce BOM cost in a 20-signal interface design?
When a design only requires 20 to 22 signal paths, choosing the 22-position TFC-111-02-F-D avoids paying for 12 unused positions present in the 34-position TFC-117-02-F-D. The shorter connector also reduces the PCB footprint by approximately 7.5 mm, freeing routing channels for other components. In production volumes of 10,000 units or more, eliminating unused pins translates to measurable material cost savings and slightly improved mechanical fit within tight board outlines.
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About SAMTEC
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 32+ | $2.3600 | $75.52 |
| 100+ | $2.1100 | $211.00 |
| 500+ | $1.8000 | $900.00 |
| 1000+ | $1.5345 | $1534.50 |
| 2500+ | $1.3000 | $3250.00 |
| 5000+ | $1.1296 | $5648.15 |
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