TFC-110-02-LM-D-A-K-TR SAMTEC Connector (Other) In Stock
The TFC-110-02-LM-D-A-K-TR is a 20-position SAMTEC Tiger Eye dual-row board-stacking connector with 1.27 mm (0.050 inch) pitch, tin-over-nickel male square-pin contacts, and peg-mount board retention for reliable high-density stacking interconnection. Tape-and-reel packaging enables automated pick-and-place assembly in compact embedded and industrial PCB stack-up designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TFC-110-02-LM-D-A-K-TR Datasheet PDF
- Category
- Connector
- Price
- From $1.4131(MOQ 56)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-110-02-LM-D-A-K-TR?
- 20-position dual-row layout at 1.27 mm (0.050 inch) pitch provides high-density board-to-board stacking in a footprint smaller than 0.050 inch pitch alternatives
- Tiger Eye contact design ensures consistent contact force and low mating resistance for reliable signal integrity across repeated board mating cycles
- Tin-over-nickel contact finish delivers corrosion resistance and compatibility with standard tin-plated mating connectors in cost-sensitive designs
- Peg-mount board retention feature locks stacked boards mechanically, reducing connector stress from vibration in portable and industrial applications
What is TFC-110-02-LM-D-A-K-TR used for?
The TFC-110-02-LM-D-A-K-TR is used in compact board-stacking architectures for embedded computing modules, wireless communication daughterboards, and sensor fusion platforms where a 20-pin dual-row 0.050 inch pitch connector provides reliable, space-efficient inter-board signal routing. Its Tiger Eye contact design and peg-mount retention suit portable electronics, industrial IoT gateways, and modular development boards that require repeated board mating cycles without contact degradation.
What are the specifications of TFC-110-02-LM-D-A-K-TR?
| YTEOL | 8.75 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 0.625inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 15u inch |
| Rated Current (Signal) | 3.1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TFC-110-02-LM-D-A-K-TR datasheet?
TFC-110-02-LM-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-110-02-LM-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TFC-110-02-LM-D-A-K-TR's 1.27 mm pitch compare to 2.54 mm pitch stacking connectors for high-density embedded module designs?
The TFC-110-02-LM-D-A-K-TR operates at 1.27 mm (0.050 inch) pitch, which places 20 positions in the same linear board length that a standard 2.54 mm (0.100 inch) pitch connector would use for only 10 positions, effectively doubling contact density in the same PCB footprint. This makes the 0.050 inch pitch Tiger Eye connector the preferred choice for compact embedded modules, RF daughterboards, and sensor expansion cards where available board edge space is limited to less than 20 mm per connector.
What mechanical retention does the peg-mount feature of the TFC-110-02-LM-D-A-K-TR provide in vibration-prone industrial or portable equipment?
The peg-mount board retention of the TFC-110-02-LM-D-A-K-TR inserts through a corresponding PCB hole to mechanically anchor the connector body, supplementing the solder joint and distributing vibration-induced shear force away from the 20 contact pins. In industrial environments with continuous vibration levels of 5 g to 20 g, or in portable devices subject to drop impacts, this retention peg prevents the board-stacking assembly from rocking on the contact tails, which would otherwise cause intermittent open-circuit failures on the signal pins over thousands of vibration cycles.
How many signal positions does the TFC-110-02-LM-D-A-K-TR support, and how should power and ground pins be allocated across the 20-position dual-row layout?
The TFC-110-02-LM-D-A-K-TR provides 20 total positions in a dual-row format with 10 pins per row at 1.27 mm pitch, allowing designers to allocate a recommended minimum of 2 to 4 pins for power and 2 to 4 pins for ground, leaving 12 to 16 pins for signal routing between stacked boards. Concentrating power and ground pins at each end of the 20-position row improves current distribution and reduces inductive coupling between high-current supply pins and adjacent signal lines in mixed power-signal board-stacking designs.
When does the tape-and-reel packaging of the TFC-110-02-LM-D-A-K-TR deliver cost and quality advantages over connectors supplied in cut strips?
The tape-and-reel format of the TFC-110-02-LM-D-A-K-TR is advantageous for production runs exceeding a few hundred units, where automated SMT pick-and-place machines can load the feeder reel and place the 20-position connector at cycle times below 2 seconds per board, compared to 10 to 30 seconds required for manual placement of cut-strip components. Tape-and-reel also reduces handling damage and contamination of the tin-over-nickel contact surfaces, which is important for maintaining low mating resistance and reliable solder joint formation when processing thousands of boards per production shift.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 56+ | $1.8400 | $103.04 |
| 224+ | $1.6500 | $369.60 |
| 2700+ | $1.5736 | $4248.85 |
| 5000+ | $1.4950 | $7475.00 |
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