TFC-109-02-L-D-A SAMTEC Connector (Other) In Stock
SAMTEC TFC-109-02-L-D-A is an 18-position Tiger Eye cost-effective dual-row terminal strip at 0.050 inch pitch with male tin-over-nickel contacts for board-to-cable connections. Designed for space-constrained PCB layouts requiring high-density interconnects in a compact profile. Available with worldwide shipping for industrial and embedded applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- TFC-109-02-L-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 18-position dual-row layout at 0.050 inch pitch enabling high-density board-to-cable connections in compact PCB designs
- Tiger Eye contact design providing superior wipe action and reliable electrical connection across repeated mating cycles
- Tin-over-nickel barrier contact finish ensuring corrosion resistance and stable contact resistance over component lifetime
- Cost-effective terminal strip format reducing BOM cost in high-volume embedded and industrial board interconnect applications
Applications
The TFC-109-02-L-D-A is suited for high-density backplane interfaces, embedded computing modules, and industrial I/O boards where 18 signals must be routed through a 0.050 inch pitch connector footprint. Its cost-effective design makes it attractive for volume production of consumer electronics, network equipment, and data acquisition systems requiring reliable dual-row board connections. The Tiger Eye contact geometry maintains low contact resistance across thermal cycling and vibration environments common in commercial and light industrial settings.
Specifications
| YTEOL | 9.4 |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 3.1A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 18 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TFC-109-02-L-D-A have and what pitch does it use?
The TFC-109-02-L-D-A is an 18-position terminal strip arranged in 2 rows at 0.050 inch (1.27 mm) pitch. This high-density layout accommodates 18 signal connections in roughly the same PCB footprint as a 9-position 0.100 inch connector, supporting miniaturization in embedded and portable board designs.
What makes the Tiger Eye contact design of TFC-109-02-L-D-A advantageous for industrial cable assemblies?
The Tiger Eye contact geometry in the TFC-109-02-L-D-A provides a wiping action as the mating connector is inserted, clearing surface oxidation from the tin-over-nickel contacts. This results in lower contact resistance and more reliable interconnect in environments with temperature cycling or mild corrosion exposure typical of industrial I/O panels.
Is TFC-109-02-L-D-A suitable for applications that require MIL or IEC connector certification?
No, the TFC-109-02-L-D-A does not conform to MIL, IEC, or DIN standards. It is a commercial-grade, cost-effective 18-position 0.050 inch pitch terminal strip designed for consumer electronics, embedded computing, and light industrial boards where standard certifications are not required and minimizing connector cost in high-volume production is the priority.
What contact finish does TFC-109-02-L-D-A use and how does the nickel barrier affect soldering?
The termination contacts use tin over a nickel barrier finish, which improves wettability during wave or reflow soldering while the nickel layer prevents tin diffusion into the copper substrate. This maintains joint integrity over 1000-hour aging cycles and prevents intermetallic growth that could increase termination resistance in 0.050 inch pitch solder joints.
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