TFC-108-02-F-D-A SAMTEC Connector (Other) In Stock

SAMTEC TFC-108-02-F-D-A is a 16-position Tiger Eye dual-row male board connector at 0.050 inch pitch with gold-on-nickel mating contacts and phosphor bronze construction achieving 15 mΩ contact resistance. Featuring tin-over-nickel termination contacts in a compact 0.925 inch body for reliable high-density board-to-board signal interconnection. Available worldwide for engineering and production volumes with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFC-108-02-F-D-AOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
16
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 16-position dual-row male board connector at 0.050 inch (1.27 mm) pitch with rectangular contact pattern for precise high-density board-to-board mating
  • Gold-on-nickel (AU on Ni) mating contact finish on phosphor bronze contacts delivering 15 mΩ contact resistance and long mating cycle life
  • Tin (Sn) over nickel (Ni) barrier termination finish providing excellent solderability in standard lead-free PCB reflow assembly processes
  • Compact 0.925 inch body length enabling 16-channel dual-row connectivity in minimal PCB footprint for space-constrained embedded and industrial boards

Applications

The TFC-108-02-F-D-A is suited for board-to-board interconnection in embedded computing modules, industrial I/O daughter cards, and test fixture interfaces where reliable 16-position dual-row signal routing is needed at 0.050 inch pitch. Its 15 mΩ contact resistance and gold-on-nickel mating finish make it reliable for low-level signal transmission in data acquisition, control, and communication boards. The compact 0.925 inch body length integrates cleanly into dense PCB layouts where multiple connectors must fit within constrained board areas.

Specifications

YTEOL9.1
Body Breadth0.225inch
Body Length0.925inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingAU ON NI
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleRND PIN-SKT
Dielectric Withstanding Voltage825VAC V
Filter FeatureNO
Insulation Resistance5000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing2.54mm
Plating ThicknessFLASH inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2.9A
Reference StandardUL, CSA
Terminal Pitch2.54mm
Termination TypeSURFACE MOUNT
Total Number of Contacts16
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

TFC-108-02-F-D-A Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact resistance and finish specification does TFC-108-02-F-D-A provide across its 16 positions?

The TFC-108-02-F-D-A achieves a contact resistance of 15 mΩ per contact, with gold-on-nickel (AU on Ni) mating contact finish on phosphor bronze contacts. This low contact resistance ensures minimal signal voltage drop and consistent electrical performance across all 16 positions in the dual-row 0.050 inch pitch connector, making it suitable for low-level analog signal, digital data bus, and clock signal routing in precision instrumentation and embedded computing boards.

How does the gold-on-nickel mating finish of TFC-108-02-F-D-A compare to matte tin alternatives for cycle life and signal integrity?

The gold-on-nickel (AU on Ni) mating contact finish of TFC-108-02-F-D-A provides superior corrosion resistance and maintains lower contact resistance than matte tin alternatives over repeated mating cycles, typically supporting hundreds to thousands of insertions with stable 15 mΩ resistance. Matte tin contacts can oxidize over time and show increased contact resistance after many cycles, making the gold-finished TFC-108-02-F-D-A the preferred choice for applications requiring consistent signal integrity in frequently mated connectors on test fixtures or hot-swap board assemblies.

For what signal types and board-to-board applications is the 16-position TFC-108-02-F-D-A most appropriate?

The TFC-108-02-F-D-A with its 16 positions, dual-row 0.050 inch pitch layout, and 15 mΩ contact resistance is most appropriate for digital control buses, SPI or I2C signal lines, low-speed data acquisition channels, and auxiliary power rails in embedded computing and industrial controller daughtercard interfaces. Applications such as sensor interface boards, PLC expansion modules, FPGA configuration header connections, and test fixture signal routing all benefit from the reliable gold-contact performance in the compact 0.925 inch body.

What is the termination contact finish of TFC-108-02-F-D-A and how does it affect PCB soldering process selection?

TFC-108-02-F-D-A uses tin (Sn) over nickel (Ni) barrier on its PCB termination contacts, which provides excellent wettability for both lead-free and leaded solder systems in wave or reflow soldering processes. The nickel barrier prevents tin-copper intermetallic diffusion into the phosphor bronze base material, extending the solder joint reliability and shelf life of the 16-position dual-row connector over production and field conditions. This finish is fully compatible with ROHS-compliant lead-free assembly at typical reflow peak temperatures.

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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