TDA3LXRBFABFRQ1 Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments TDA3LXRBFABFRQ1 is an automotive-grade low-power SoC integrating processing, imaging, and vision acceleration for ADAS applications in a 367-FCBGA package rated -40 to 125°C. Supports AEC-Q100 automotive qualification for functional safety. Available worldwide with global shipping.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
TDA3LXRBFABFRQ1BGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
367
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TDA3LXRBFABFRQ1?

  • Integrated imaging and vision acceleration hardware enabling real-time ADAS processing at automotive grade (-40 to 125°C)
  • 367-FCBGA fine-pitch package at 22x22 mm supporting high pin-count signal routing for advanced sensor fusion SoCs
  • AEC-Q100 qualified design optimized for low power consumption in always-on automotive perception systems

What is TDA3LXRBFABFRQ1 used for?

The TDA3LXRBFABFRQ1 is purpose-built for automotive ADAS platforms including surround-view camera systems, forward collision warning, and lane departure detection. Its integrated vision accelerator offloads image processing from the main CPU, reducing system power consumption and latency in safety-critical pipelines. The wide -40 to 125°C operating range ensures reliable operation across full automotive environmental conditions.

What are the specifications of TDA3LXRBFABFRQ1?

Pbfree CodeYes
Date Of Intro2017-08-03
YTEOL15
JESD-30 CodeS-PBGA-B367
JESD-609 Codee1
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA367,22X22,25
Package ShapeSQUARE
Package StyleGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)250
Screening LevelAEC-Q100
Supply Voltage-Max1.11V
Supply Voltage-Min1.02V
Supply Voltage-Nom1.06V
Surface MountYES
TechnologyCMOS
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch0.65mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeSoC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN3A991.A.1
HTS Code8542.31.00.35

Where can I find the TDA3LXRBFABFRQ1 datasheet?

TDA3LXRBFABFRQ1 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for TDA3LXRBFABFRQ1?

Compatible alternatives and drop-in replacements for TDA3LXRBFABFRQ1:

TDA3LXRBFABFQ1Texas Instruments

SoC, CMOS, PBGA367

View Part →

Frequently Asked Questions

What operating temperature range does the TDA3LXRBFABFRQ1 support, and why does that matter for automotive designs?

The TDA3LXRBFABFRQ1 is rated for -40 to 125°C, covering the full AEC-Q100 automotive temperature Grade 1 requirement. This range ensures the SoC operates reliably in engine compartment proximity and in cold climates without performance degradation, which is critical for ADAS systems that must function at vehicle startup in extreme environments.

How does the 367-FCBGA package influence PCB design for the TDA3LXRBFABFRQ1?

The 367-FCBGA package measures 22x22 mm with a fine-pitch ball grid array, requiring HDI PCB processes with microvias to route all 367 pins effectively. Designers should plan for at least 6-layer stackups and use proper BGA escape routing strategies to connect high-speed imaging interfaces and power rails without signal integrity issues at the 250°C peak reflow temperature.

Which ADAS sensor fusion architectures can the TDA3LXRBFABFRQ1 accelerate compared to a general-purpose processor?

The TDA3LXRBFABFRQ1 integrates dedicated vision and imaging accelerators that process camera streams at automotive frame rates faster than a general-purpose ARM core alone, enabling surround-view stitching, object detection, and depth estimation with lower latency. Applications including 360-degree parking assist and forward collision warning with 4 or more camera inputs benefit from its hardware acceleration pipeline operating across the -40 to 125°C automotive range.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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