TDA3LXRBFABFRQ1 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments TDA3LXRBFABFRQ1 is an automotive-grade low-power SoC integrating processing, imaging, and vision acceleration for ADAS applications in a 367-FCBGA package rated -40 to 125°C. Supports AEC-Q100 automotive qualification for functional safety. Available worldwide with global shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 367
- Lifecycle
- ACTIVE
- Datasheet
- TDA3LXRBFABFRQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TDA3LXRBFABFRQ1?
- Integrated imaging and vision acceleration hardware enabling real-time ADAS processing at automotive grade (-40 to 125°C)
- 367-FCBGA fine-pitch package at 22x22 mm supporting high pin-count signal routing for advanced sensor fusion SoCs
- AEC-Q100 qualified design optimized for low power consumption in always-on automotive perception systems
What is TDA3LXRBFABFRQ1 used for?
The TDA3LXRBFABFRQ1 is purpose-built for automotive ADAS platforms including surround-view camera systems, forward collision warning, and lane departure detection. Its integrated vision accelerator offloads image processing from the main CPU, reducing system power consumption and latency in safety-critical pipelines. The wide -40 to 125°C operating range ensures reliable operation across full automotive environmental conditions.
What are the specifications of TDA3LXRBFABFRQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2017-08-03 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B367 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA367,22X22,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.11V |
| Supply Voltage-Min | 1.02V |
| Supply Voltage-Nom | 1.06V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.1 |
| HTS Code | 8542.31.00.35 |
Where can I find the TDA3LXRBFABFRQ1 datasheet?
TDA3LXRBFABFRQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TDA3LXRBFABFRQ1?
Compatible alternatives and drop-in replacements for TDA3LXRBFABFRQ1:
Frequently Asked Questions
What operating temperature range does the TDA3LXRBFABFRQ1 support, and why does that matter for automotive designs?
The TDA3LXRBFABFRQ1 is rated for -40 to 125°C, covering the full AEC-Q100 automotive temperature Grade 1 requirement. This range ensures the SoC operates reliably in engine compartment proximity and in cold climates without performance degradation, which is critical for ADAS systems that must function at vehicle startup in extreme environments.
How does the 367-FCBGA package influence PCB design for the TDA3LXRBFABFRQ1?
The 367-FCBGA package measures 22x22 mm with a fine-pitch ball grid array, requiring HDI PCB processes with microvias to route all 367 pins effectively. Designers should plan for at least 6-layer stackups and use proper BGA escape routing strategies to connect high-speed imaging interfaces and power rails without signal integrity issues at the 250°C peak reflow temperature.
Which ADAS sensor fusion architectures can the TDA3LXRBFABFRQ1 accelerate compared to a general-purpose processor?
The TDA3LXRBFABFRQ1 integrates dedicated vision and imaging accelerators that process camera streams at automotive frame rates faster than a general-purpose ARM core alone, enabling surround-view stitching, object detection, and depth estimation with lower latency. Applications including 360-degree parking assist and forward collision warning with 4 or more camera inputs benefit from its hardware acceleration pipeline operating across the -40 to 125°C automotive range.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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