TDA3LXRBFABFQ1 Texas Instruments Integrated Circuit (BGA) In Stock
TDA3LXRBFABFQ1 is an AEC-Q100 Grade 1 automotive SoC integrating processing cores with hardware imaging and vision acceleration for ADAS applications. Operates across -40°C to +125°C in a 367-ball FCBGA package. Available from stock worldwide at competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 367
- Lifecycle
- ACTIVE
- Datasheet
- TDA3LXRBFABFQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TDA3LXRBFABFQ1?
- Dedicated hardware vision acceleration engine enables real-time processing of camera and radar sensor data for ADAS surround-view and object detection at automotive safety integrity levels
- AEC-Q100 Grade 1 automotive qualification with -40°C to +125°C operating range ensures reliable operation in under-hood and harsh vehicular environments
- 367-ball FCBGA package integrates CPU, DSP, and imaging accelerators enabling complete ADAS front-end SoC with minimal external components
What is TDA3LXRBFABFQ1 used for?
TDA3LXRBFABFQ1 is designed as the central processing SoC in automotive ADAS systems including surround-view cameras, rear-view monitors, blind-spot detection, and pedestrian recognition. Its integrated vision acceleration hardware enables low-latency processing of data from multiple camera inputs, radar sensors, and LiDAR in vehicle perception pipelines. The AEC-Q100 Grade 1 qualification and -40°C to +125°C operating range make it suitable for direct deployment in automotive ECU modules and ADAS domain controllers.
What are the specifications of TDA3LXRBFABFQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2017-08-03 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B367 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA367,22X22,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.11V |
| Supply Voltage-Min | 1.02V |
| Supply Voltage-Nom | 1.06V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.1 |
| HTS Code | 8542.31.00.75 |
Where can I find the TDA3LXRBFABFQ1 datasheet?
TDA3LXRBFABFQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TDA3LXRBFABFQ1?
Compatible alternatives and drop-in replacements for TDA3LXRBFABFQ1:
Frequently Asked Questions
Which ADAS sensor processing workloads can TDA3LXRBFABFQ1 handle and at what resolution or frame rate?
TDA3LXRBFABFQ1 targets surround-view camera processing, object detection, lane departure warning, and pedestrian recognition workloads using its integrated vision accelerator and DSP cores. The hardware imaging pipeline supports processing of multiple camera streams at resolutions up to 1080p at 30 fps, enabling real-time ADAS feature execution within a single automotive-grade SoC.
What is the automotive qualification level of TDA3LXRBFABFQ1 and what operating temperature does it support?
TDA3LXRBFABFQ1 is AEC-Q100 Grade 1 qualified, covering an operating temperature range of -40°C to +125°C. This Grade 1 rating confirms reliability across extreme automotive thermal cycling conditions encountered in engine compartment and under-hood ECU placements, meeting the requirements of ISO 26262 ADAS safety architectures.
How does TDA3LXRBFABFQ1 compare to a general-purpose automotive MCU for camera-based ADAS processing?
Unlike a general-purpose automotive MCU that relies on software-only image processing on a single CPU core, TDA3LXRBFABFQ1 integrates dedicated hardware vision accelerators alongside DSP and CPU subsystems. This hardware acceleration reduces camera pipeline latency to under 50 ms for object classification tasks, delivering 5–10x higher throughput than a software-only Cortex-R or Cortex-M based MCU at equivalent clock speeds.
What package does TDA3LXRBFABFQ1 use and what PCB design considerations apply for high-speed automotive layouts?
TDA3LXRBFABFQ1 is packaged in a 367-ball FCBGA measuring 22 mm × 22 mm with a 0.65 mm ball pitch, requiring controlled-impedance PCB routing for DDR and camera interface signals. Designers must implement 4-6 layer impedance-controlled stackups with 50 Ω single-ended and 100 Ω differential traces to meet signal integrity requirements for the high-speed memory interfaces at frequencies exceeding 400 MHz.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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