TDA2PHGRQACDRQ1 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments TDA2Px ADAS applications processor in 784-FCBGA package, AEC-Q100 qualified for automotive use. Features advanced vision processing cores supporting up to 8 camera inputs. Operating temperature -40°C to 125°C, designed for next-generation ADAS and autonomous driving systems.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 784
- Lifecycle
- ACTIVE
- Datasheet
- TDA2PHGRQACDRQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TDA2PHGRQACDRQ1?
- AEC-Q100 Grade 1 automotive qualified for -40°C to 125°C operation
- 784-pin FCBGA package with advanced multi-core vision processing architecture
- Supports up to 8 camera inputs for ADAS surround-view and object detection
- Integrated ISP and DSP cores for real-time automotive image processing
What is TDA2PHGRQACDRQ1 used for?
The TDA2PHGRQACDRQ1 is purpose-built for automotive ADAS applications including surround-view camera systems, lane departure warning, and pedestrian detection. Its multi-core architecture handles parallel video streams from up to 8 cameras, enabling 360-degree perception systems. It is also suited for driver monitoring systems and highway pilot features in L2+ and L3 autonomous vehicles.
What are the specifications of TDA2PHGRQACDRQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2019-01-06 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B784 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.2V |
| Supply Voltage-Min | 1.11V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.30 |
Where can I find the TDA2PHGRQACDRQ1 datasheet?
TDA2PHGRQACDRQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TDA2PHGRQACDRQ1?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the operating temperature range of the TDA2PHGRQACDRQ1 and what automotive qualification does it carry?
The TDA2PHGRQACDRQ1 operates from -40°C to 125°C and is qualified to AEC-Q100 Grade 1, making it suitable for underhood and harsh automotive environments. This qualification ensures reliability across the full extended automotive temperature range required for safety-critical ADAS applications.
How many camera inputs can the TDA2PHGRQACDRQ1 support for a surround-view ADAS system?
The TDA2PHGRQACDRQ1 supports up to 8 camera inputs simultaneously, enabling full 360-degree surround-view ADAS systems. Its integrated image signal processor and DSP cores handle real-time processing of multiple parallel video streams at automotive-grade reliability, making it ideal for L2+ and L3 autonomous driving platforms.
What package does the TDA2PHGRQACDRQ1 use and what are the key dimensions to consider for PCB layout?
The TDA2PHGRQACDRQ1 uses a 784-pin Fine Pitch Ball Grid Array (FCBGA) package measuring 23mm x 23mm. This high-density BGA package requires careful PCB design with controlled impedance routing for high-speed interfaces, proper thermal management with at least 4-layer copper planes, and adherence to TI's recommended land pattern for reliable solder joint formation.
Which ADAS processing tasks make TDA2PHGRQACDRQ1 preferable over simpler single-core SoCs?
When a design requires parallel processing of 4 to 8 camera feeds with onboard ISP, DSP, and vision acceleration in a single 23mm BGA package, the TDA2PHGRQACDRQ1 outperforms simpler SoCs. Applications such as combined surround-view, object classification, and highway pilot demand its heterogeneous multi-core architecture and AEC-Q100 automotive certification that entry-level processors cannot match.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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