STM32MP133DAG7 STMicroelectronics Integrated Circuit (BGA) In Stock
STM32MP133DAG7 is a single-core Arm Cortex-A7 MPU running up to 1 GHz with dual Ethernet, 2x CAN FD, 2x ADC, and 24 timers. It integrates hardware cryptography, DDR3/3L support, and extensive connectivity in a BGA-289 package. From stock, worldwide shipping available.
- Manufacturer
- STMicroelectronics
- Package
- BGA
- Pin Count
- 289
- Lifecycle
- ACTIVE
- Datasheet
- STM32MP133DAG7 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $4.4480(MOQ 100)
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Single-core Arm Cortex-A7 at up to 1 GHz for high-performance embedded Linux applications
- Dual 10/100/1000 Ethernet MACs with IEEE 1588 hardware timestamping for industrial networking
- 2x CAN FD interfaces enabling robust real-time communication in automotive and industrial designs
- Hardware security block including HASH, RNG, and PKA for secure boot and data encryption
- Flexible DDR3/DDR3L memory interface with 16-bit bus supporting up to 1 GB RAM
Applications
The STM32MP133DAG7 targets industrial control systems, edge gateways, and HMI panels requiring a full embedded Linux stack with real-time peripherals. Its dual Ethernet and CAN FD support make it well-suited for smart factory automation, motor drives, and industrial IoT edge nodes. The integrated cryptography and secure boot capabilities also address security-sensitive applications such as industrial firewalls and secure telemetry devices.
Specifications
| Factory Lead Time | 13Weeks |
| YTEOL | 9 |
| Address Bus Width | 26 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 48MHz |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B289 |
| Low Power Mode | YES |
| Number of DMA Channels | 56 |
| Number of Serial I/Os | 10 |
| On Chip Data RAM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA289,17X17,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| RAM (words) | 172032 |
| Speed | 1000MHz |
| Supply Current-Max | 268mA |
| Supply Voltage-Max | 1.38V |
| Supply Voltage-Min | 1.32V |
| Supply Voltage-Nom | 1.35V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Philippines, Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for STM32MP133DAG7:
Frequently Asked Questions
What is the maximum CPU clock speed of the STM32MP133DAG7, and which core architecture does it use?
The STM32MP133DAG7 uses a single Arm Cortex-A7 core running at up to 1 GHz. This 32-bit ARMv7-A architecture supports an L1 cache and is capable of running embedded Linux, making it suitable for feature-rich industrial applications requiring operating system support.
Which connectivity interfaces does the STM32MP133DAG7 provide for industrial networking and automation?
The device integrates 2x Gigabit Ethernet MACs with IEEE 1588 timestamping, 2x CAN FD controllers, USB OTG, and an SDMMC interface. These interfaces, combined with 24 timers and 2x 12-bit ADCs, make the STM32MP133DAG7 an excellent fit for industrial automation and IoT gateway designs operating on a 3.3 V I/O rail.
When should an engineer choose STM32MP133DAG7 over STM32MP131 for a new industrial design?
Engineers should select the STM32MP133DAG7 over the entry-level STM32MP131 when the design requires dual Ethernet (2x GMAC), CAN FD support, or greater DDR memory bandwidth via the 16-bit DDR3/DDR3L bus. The DAG7 suffix denotes the 289-ball BGA package with the widest peripheral set in the STM32MP13 family, supporting higher integration at up to 1 GHz.
What package does the STM32MP133DAG7 use, and how does it affect PCB layout complexity?
The STM32MP133DAG7 is housed in a 289-ball TFBGA package (BGA-289) with a 0.5 mm pitch ball grid. This fine-pitch BGA requires a minimum of 4 PCB layers, controlled-impedance DDR3 routing at 16-bit width, and careful power-plane segmentation to meet the device's 1.8 V core and 3.3 V I/O supply requirements.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $5.5600 | $556.00 |
| 250+ | $4.8947 | $1223.68 |
| 500+ | $4.7239 | $2361.95 |
| 1000+ | $4.5746 | $4574.60 |
| 6240+ | $4.4710 | $27899.16 |
| 12480+ | $4.4480 | $55510.79 |
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