STM32MP133AAE3 STMicroelectronics Integrated Circuit (BGA) In Stock
STMicroelectronics STM32MP133AAE3 is a single-core Arm Cortex-A7 microprocessor running up to 1 GHz, integrating dual Ethernet, 2× CAN FD, 2× 12-bit ADC, and 24 timers in a 289-ball BGA package. It targets industrial and IoT edge applications requiring real-time connectivity and multimedia processing without a full MPU OS. Available from authorized distributors with worldwide shipping.
- Manufacturer
- STMicroelectronics
- Package
- BGA
- Pin Count
- 289
- Lifecycle
- ACTIVE
- Datasheet
- STM32MP133AAE3 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $5.5009(MOQ 714)
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Single Arm Cortex-A7 core running up to 1 GHz with 32-bit fixed-point DSP extension for real-time industrial processing
- Dual Gigabit Ethernet MAC controllers and 2× CAN FD interfaces enabling converged industrial networking on a single chip
- Integrated 2× 12-bit SAR ADC with up to 16 channels plus 24 timers for flexible multi-axis motor control and sensor acquisition
- 289-ball TFBGA package (S-PBGA-B289) rated for industrial temperature range, optimized for compact high-density PCB footprints
Applications
The STM32MP133AAE3 is well-suited for industrial IoT gateways and edge controllers that require dual Ethernet connectivity, real-time fieldbus (CAN FD), and sensor data acquisition in a single-core MPU. It targets motor drive systems, building automation, and smart energy meters where the Cortex-A7 at 1 GHz provides sufficient compute for lightweight Linux or RTOS workloads. Its 289-ball BGA form factor and wide peripheral integration also make it a cost-effective choice for communication concentrators and industrial HMI panels.
Specifications
| Factory Lead Time | 13Weeks |
| YTEOL | 9 |
| Address Bus Width | 26 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 48MHz |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B289 |
| Low Power Mode | YES |
| Number of DMA Channels | 56 |
| Number of Serial I/Os | 10 |
| On Chip Data RAM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA289,17X17,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| RAM (words) | 172032 |
| Speed | 650MHz |
| Supply Current-Max | 239mA |
| Supply Voltage-Max | 1.38V |
| Supply Voltage-Min | 1.21V |
| Supply Voltage-Nom | 1.25V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Philippines, Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How fast is the STM32MP133AAE3 CPU core, and what type of workloads can it handle at 1 GHz?
The STM32MP133AAE3 features a single Arm Cortex-A7 core running up to 1 GHz, providing enough processing power for lightweight Linux distributions, real-time RTOS tasks, and industrial protocol stacks such as MODBUS or OPC-UA. It includes a 32-bit fixed-point DSP instruction set extension, making it suitable for signal processing and motor control algorithms. The 1 GHz ceiling accommodates multi-threaded IoT gateway workloads without the power overhead of higher-end dual-core MPUs.
What networking peripherals are integrated in the STM32MP133AAE3 for industrial connectivity designs?
The STM32MP133AAE3 integrates 2× Gigabit Ethernet MAC controllers and 2× CAN FD interfaces, covering the two most common industrial networking standards in a single device. The dual Ethernet ports support daisy-chain topologies or independent network segments, while CAN FD at up to 8 Mbit/s enables time-sensitive fieldbus communications. This combination reduces external silicon count and PCB area compared to designs that add Ethernet and CAN controllers separately.
What package does STM32MP133AAE3 use, and how does its 289-ball BGA affect PCB layout for compact industrial boards?
The STM32MP133AAE3 is housed in a 289-ball Thin Fine-pitch Ball Grid Array (TFBGA) package with a 0.5 mm ball pitch, requiring a 4-layer or 6-layer PCB for adequate signal routing and power delivery. The compact BGA footprint shrinks board area compared to LQFP alternatives at similar pin counts. Designers must account for controlled-impedance traces for DDR memory interfaces, but the BGA package enables significantly denser layouts in 19" rack modules or embedded SBC form factors.
When would STM32MP133AAE3 be preferred over STM32MP135 or STM32MP151 for a new industrial design?
The STM32MP133AAE3 is a cost-optimized single-core option compared to the dual-core STM32MP151, making it preferable when the application requires only a single 1 GHz Cortex-A7 thread, dual Ethernet, and 2× CAN FD without GPU or display interfaces. Against the STM32MP135, the MP133 trades off some peripheral count for a smaller die and lower cost in high-volume production. It is the right choice when BOM cost matters more than peak throughput and when 13-week lead times are acceptable given project timelines.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 714+ | $5.7000 | $4069.80 |
| 2856+ | $5.5576 | $15872.45 |
| 5712+ | $5.5292 | $31582.96 |
| 11424+ | $5.5009 | $62841.94 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
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