STA8090EXGA STMicroelectronics Integrated Circuit (BGA) In Stock
The STA8090EXGA is an AEC-Q100 qualified multi-constellation GNSS receiver SoC from STMicroelectronics, operating at 1.1 V nominal supply in a 169-ball TFBGA package. It supports GPS, GLONASS, and other satellite navigation systems for automotive-grade positioning applications.
- Manufacturer
- STMicroelectronics
- Package
- BGA
- Pin Count
- 169
- Lifecycle
- ACTIVE
- Datasheet
- STA8090EXGA Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- AEC-Q100 automotive qualification ensures reliability across the full -40°C to 125°C automotive temperature range
- Multi-constellation GNSS receiver supports GPS, GLONASS, and additional satellite navigation systems for improved fix accuracy
- 1.1 V nominal core supply voltage reduces power consumption in embedded automotive and telematics systems
- 169-ball TFBGA package provides a compact fine-pitch footprint suitable for high-density automotive PCB designs
- Integrated GNSS SoC architecture reduces external component count and simplifies antenna and RF front-end interfacing
Applications
The STA8090EXGA is designed for automotive telematics units, vehicle tracking systems, and connected navigation modules requiring AEC-Q100 qualified GNSS positioning in a compact SoC form factor. Its multi-constellation support improves position accuracy and satellite availability in urban canyons and challenging signal environments typical of in-vehicle navigation. The device is also suitable for fleet management systems, emergency call (eCall) modules, and V2X communication platforms operating over the full automotive temperature range.
Specifications
| Factory Lead Time | 19Weeks |
| JESD-30 Code | S-PBGA-B169 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Nom | 1.1V |
| Surface Mount | YES |
| Technology | CMOS |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 7A994 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for STA8090EXGA:
Frequently Asked Questions
What automotive qualification standard does the STA8090EXGA meet and what temperature range does that cover?
The STA8090EXGA is qualified to AEC-Q100, the standard automotive IC reliability qualification, covering junction temperatures from -40°C to 125°C. This qualification ensures the device withstands the harsh thermal cycling, humidity, and vibration conditions found in automotive under-hood and passenger compartment environments without reliability degradation.
Which GNSS constellations does the STA8090EXGA support and how does that improve positioning?
The STA8090EXGA supports multiple GNSS constellations including GPS and GLONASS, increasing the number of visible satellites from typically 8 to 12 for GPS-only to 16 to 24 combined, which significantly improves position fix acquisition time, accuracy to within 2.5 meters CEP, and availability in signal-challenged environments such as dense urban areas and tunnels.
What is the supply voltage for the STA8090EXGA and how does it integrate into a typical automotive power rail?
The STA8090EXGA operates at a nominal core supply voltage of 1.1 V, which is typically generated from the vehicle's 12 V battery through a DC-DC step-down converter and LDO regulator chain. I/O interfaces may operate at 1.8 V or 3.3 V depending on the peripheral configuration, allowing direct interfacing with automotive microcontrollers and communication SoCs.
How does the 169-ball TFBGA package of the STA8090EXGA affect PCB design and assembly?
The STA8090EXGA TFBGA-169 package features a fine pitch of approximately 0.65 mm between ball centers in a square body, requiring at least a 4-layer PCB with controlled impedance for RF signal integrity and via-in-pad or dog-bone fanout routing for the inner ball rows. At a 260°C peak reflow temperature, it is compatible with standard lead-free SAC305 solder assembly used in automotive Tier 1 manufacturing.
For an eCall module design, why would the STA8090EXGA be preferred over a non-automotive-grade GNSS chip?
eCall systems must meet ISO 26262 functional safety and UNECE R94/R95 requirements, which mandate automotive-grade components rated for -40°C to 125°C operation and qualified to AEC-Q100. Using the AEC-Q100-qualified STA8090EXGA ensures compliance with these standards and reduces the risk of field failures that could prevent emergency positioning transmission during a vehicle accident, whereas consumer-grade GNSS ICs typically cover only 0°C to 70°C.
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STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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