ST33HTPH2E32AHD0 STMicroelectronics Integrated Circuit (Quad Flat No-Lead) In Stock
The ST33HTPH2E32AHD0 is a flash-memory-based Trusted Platform Module (TPM) from STMicroelectronics supporting both TPM 1.2 and TPM 2.0 standards via SPI interface. It features 32 KB of NVM, hardware cryptographic acceleration, and operates at 3.3 V. Designed for secure boot and platform integrity applications in industrial and embedded systems.
- Manufacturer
- STMicroelectronics
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- ACTIVE
- Datasheet
- ST33HTPH2E32AHD0 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual TPM 1.2 and TPM 2.0 protocol support in a single device
- Hardware cryptographic acceleration including RSA, ECC, SHA, and AES engines
- 32 KB of integrated non-volatile flash memory for secure key storage
- SPI interface operating at 3.3 V nominal voltage
- Ultra-thin QFN-32 package suitable for space-constrained board designs
Applications
The ST33HTPH2E32AHD0 is used in applications requiring hardware-rooted security, such as secure boot in industrial PCs, embedded controllers, and IoT gateways. It enables platform integrity measurement and attestation in enterprise servers and network equipment where TPM 2.0 compliance is mandatory. The device is also deployed in automotive and aerospace systems that demand tamper-resistant cryptographic key storage.
Specifications
| Factory Lead Time | 20Weeks |
| Date Of Intro | 2019-11-12 |
| Additional Feature | ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
| JESD-30 Code | S-XQCC-N32 |
| JESD-609 Code | e4 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC32,.2SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Nom | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| uPs/uCs/Peripheral ICs Type | CRYPTOGRAPHIC AUTHENTICATOR |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.30 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What cryptographic algorithms does the ST33HTPH2E32AHD0 hardware accelerate?
The ST33HTPH2E32AHD0 accelerates RSA up to 2048-bit, ECC, AES-128/256, SHA-1, and SHA-256 in dedicated hardware engines, delivering fast cryptographic operations without burdening the host CPU, making it suitable for latency-sensitive security applications.
Which host interface does ST33HTPH2E32AHD0 use, and at what supply voltage does it operate?
The ST33HTPH2E32AHD0 uses a 4-wire SPI interface and operates at a nominal supply voltage of 3.3 V, with support also at 3.3 V ±10%, ensuring compatibility with the majority of modern microcontroller and embedded processor platforms.
Can ST33HTPH2E32AHD0 support both TPM 1.2 and TPM 2.0 simultaneously on the same platform?
Yes, the ST33HTPH2E32AHD0 integrates both TPM 1.2 and TPM 2.0 firmware stacks within its 32 KB NVM, allowing the host system to select the active protocol mode, which simplifies migration from legacy TPM 1.2 infrastructure to TPM 2.0 without hardware changes.
What package does the ST33HTPH2E32AHD0 use and how does it aid PCB integration?
The ST33HTPH2E32AHD0 comes in a 32-pin QFN (Quad Flat No-Lead) package with a 5x5 mm body and 0.5 mm pitch, providing a compact footprint with an exposed thermal pad that improves heat dissipation on dense PCBs.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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