ST33HTPH2032AHC3 STMicroelectronics Integrated Circuit (Quad Flat No-Lead) In Stock
STMicroelectronics ST33HTPH2032AHC3 is a TCG-compliant Trusted Platform Module 2.0 with I2C interface, operating at 1.8 V nominal supply and also supporting 3.3 V, housed in a 32-pin QFN package for secure key storage and platform authentication in embedded systems.
- Manufacturer
- STMicroelectronics
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- ST33HTPH2032AHC3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- TCG TPM 2.0 compliant with I2C host interface for secure platform authentication
- 1.8 V nominal supply with 3.3 V compatibility for flexible system integration
- 32-pin LCC/QFN package (S-XQCC-N32) with very thin profile for space-constrained designs
- CMOS technology for low power consumption in always-on security functions
- Hardware-protected key storage, random number generation, and platform integrity measurement
- Supports SHA-256 and RSA 2048-bit cryptographic operations for modern security requirements
Applications
ST33HTPH2032AHC3 is deployed in industrial IoT gateways, embedded Linux platforms, and network infrastructure equipment requiring hardware-rooted boot integrity and cryptographic key protection compliant with TCG TPM 2.0. Its I2C interface and compact 32-pin footprint make it straightforward to integrate into resource-constrained single-board computers and secure element designs.
Specifications
| YTEOL | 3 |
| Additional Feature | ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
| JESD-30 Code | S-XQCC-N32 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC32,.2SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Nom | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | CRYPTOGRAPHIC AUTHENTICATOR |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.30 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What supply voltage does ST33HTPH2032AHC3 require and can it operate directly from a 3.3 V microcontroller rail?
ST33HTPH2032AHC3 operates at a nominal 1.8 V supply but also supports 3.3 V operation as noted in its specifications. Designers using a 3.3 V main rail can power it directly without a dedicated 1.8 V LDO, simplifying the power distribution network in TPM-secured embedded platforms.
How does ST33HTPH2032AHC3 communicate with the host processor and what data rate does it support?
ST33HTPH2032AHC3 uses a TCG-standard I2C interface to communicate with the host processor, supporting standard I2C clock rates of up to 400 kHz (Fast Mode). This low-speed interface is sufficient for TPM command exchange, which typically involves small 32-byte to 256-byte command and response payloads.
What cryptographic key sizes does ST33HTPH2032AHC3 support for platform security certification?
ST33HTPH2032AHC3 supports RSA 2048-bit key generation and signing, SHA-256 hash operations, and AES 128-bit symmetric encryption as part of its TPM 2.0 algorithm suite. These capabilities meet the cryptographic requirements of FIDO2, secure boot chains, and TCG PC Client Platform TPM Profile specifications.
For an industrial IoT gateway design, how does the 32-pin QFN package of ST33HTPH2032AHC3 affect board layout?
The 32-pin LCC/QFN (S-XQCC-N32) package has a square, very thin chip-carrier body with a 0.5 mm pitch, occupying minimal board area. The exposed thermal pad underneath improves heat dissipation and reduces the overall stack height, which is important in densely populated industrial gateway PCBs where vertical clearance is limited.
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