SPSB081C5 STMicroelectronics Integrated Circuit (Quad Flat No-Lead) In Stock
SPSB081C5 is an automotive-grade power management IC from STMicroelectronics integrating LIN and CAN-FD transceivers, designed for body electronics and in-vehicle network nodes, housed in a compact QFN package.
- Manufacturer
- STMicroelectronics
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- ACTIVE
- Datasheet
- SPSB081C5 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Integrated LIN and CAN-FD transceivers enable multi-protocol in-vehicle network connectivity in a single automotive IC
- Automotive-grade design ensures operation across -40°C to 125°C temperature range for harsh under-hood environments
- QFN package provides low-profile surface-mount assembly suitable for space-constrained automotive ECU PCBs
Applications
SPSB081C5 is used in automotive body control modules, door and window ECUs, and gateway nodes that require simultaneous LIN and CAN-FD bus connectivity along with local power management. It is suited for smart actuator and sensor nodes in ADAS sub-systems and body electronics where integrating communication transceivers and power regulation in a single IC reduces BOM and PCB area. The automotive-grade qualification supports reliable operation in temperature ranges from -40°C to 125°C typical of passenger vehicle environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for SPSB081C5:
Frequently Asked Questions
Which communication protocols does SPSB081C5 support, and why is that combination valuable in automotive networks?
SPSB081C5 integrates both LIN and CAN-FD transceivers in a single IC. LIN is used for low-speed sensor and actuator networks such as seat motors and window controls, while CAN-FD supports high-speed backbone communication at data rates up to 8 Mbit/s. Combining both in one device reduces the external component count and simplifies gateway and body control module designs where both protocols coexist on the same ECU.
What temperature range does SPSB081C5 support, and does it meet automotive reliability standards?
SPSB081C5 is designed for automotive applications and operates reliably across a temperature range of -40°C to 125°C, covering both cold-start winter conditions and under-hood thermal environments. STMicroelectronics qualifies automotive-grade ICs in accordance with AEC-Q100 Grade 1 reliability standards, ensuring long-term performance in passenger and commercial vehicle applications over a typical 15-year vehicle lifetime.
What package does SPSB081C5 use, and how does it benefit automotive ECU PCB design?
SPSB081C5 is housed in a QFN (Quad Flat No-Lead) package, which offers a smaller PCB footprint than SOIC or QFP alternatives while providing an exposed thermal pad for improved heat dissipation. In automotive ECUs where board space is limited and thermal management is critical, QFN packages allow designers to fit more functionality per square centimeter while maintaining reliable thermal contact with the PCB ground plane.
For an automotive body control module, when does integrating SPSB081C5 reduce system cost compared to discrete transceivers?
When a body control module requires both LIN and CAN-FD connectivity plus local power management, using SPSB081C5 eliminates at least 2 separate transceiver ICs and associated decoupling components. This integration can reduce the BOM by 10 to 15 components, lower the PCB area requirement by 20 to 30%, and reduce power supply design complexity, delivering meaningful cost and size savings in high-volume automotive production programs.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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