SN74LVC827APWG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The SN74LVC827APWG4 is a 10-channel buffer and line driver with 3-state outputs from Texas Instruments in the LVC logic family. Key specs: active-low enable, 24 mA output drive, 24-pin TSSOP package. In stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- SN74LVC827APWG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-channel bus driver configuration supports wide parallel data buses in microprocessor and FPGA systems
- 3-state outputs with active-low enable allow efficient shared-bus topologies without bus contention
- LVC logic family operates from 1.65 V to 3.6 V with 5 V tolerant inputs for mixed-voltage compatibility
- RoHS compliant e4 packaging meets modern environmental standards for industrial and commercial designs
Applications
The SN74LVC827APWG4 is used as a high-drive bus buffer in microprocessor systems where 10-bit parallel data buses require signal strengthening and isolation between logic stages. Its 3-state control enables multiple devices to share a common parallel bus in embedded computing, FPGA expansion, and industrial control applications. The compact 24-pin TSSOP package makes it suitable for high-density PCB designs in communications equipment and data acquisition systems.
Specifications
| YTEOL | 0 |
| Control Type | ENABLE LOW |
| Family | LVC/LCX/Z |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.024A |
| Number of Bits | 10 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Prop. Delay@Nom-Sup | 6.7ns |
| Propagation Delay (tpd) | 7.1ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many channels does the SN74LVC827APWG4 have?
The SN74LVC827APWG4 is a 10-channel device, providing ten independent buffer and line driver paths with 3-state output control, making it ideal for wide parallel bus interfacing in microprocessor and FPGA-based digital systems.
What is the output drive current of the SN74LVC827APWG4?
The SN74LVC827APWG4 provides a maximum low-level output current (Iol) of 24 mA per channel, enabling it to reliably drive multiple loads on a parallel data bus without signal degradation.
What package is the SN74LVC827APWG4 available in?
The SN74LVC827APWG4 is available in a 24-pin TSSOP (Thin Shrink Small Outline Package) surface-mount package, offering a compact footprint suitable for high-density PCB layouts in communications and embedded system designs.
What logic family does the SN74LVC827APWG4 belong to?
The SN74LVC827APWG4 belongs to the LVC (Low-Voltage CMOS) logic family, supporting supply voltages from 1.65 V to 3.6 V and featuring 5 V tolerant inputs for backward compatibility with older 5 V CMOS and TTL logic circuits.
Related Guides
SN74LVC14APWR Hex Schmitt-Trigger Inverter: Application Note and Design Guide
Complete design guide for the SN74LVC14APWR hex Schmitt-trigger inverter: thresholds, decoupling, oscillator design, package selection, and common pitfalls.
May 21, 2026
TPS62841DGRR Buck Converter Selection Guide: Ultra-Low 60 nA IQ for Battery-Powered IoT
How to choose the right TPS62841 variant for IoT, wearables, and wireless sensors: quiescent current, voltage range, package, and application examples.
May 21, 2026
TPS54160DGQR Selection Guide: How to Choose a 60V Step-Down Buck Converter
Complete selection guide for the TPS54160DGQR 60V/1.5A step-down converter. Compare specs, alternatives, and sourcing options for industrial and automotive designs.
May 20, 2026
LMV932MM Dual Low-Voltage CMOS Op-Amp: Application Design Guide
Complete application design guide for the LMV932MM dual rail-to-rail CMOS op-amp: supply decoupling, RRIO design rules, stability, and recommended circuits for 1.8V–5.5V battery-powered systems.
May 20, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
ISO7840FDW
Small Outline Packages
Integrated Circuit
ISO7820FDWR
Small Outline Packages
Integrated Circuit
ISO7763FQDBQRQ1
Small Outline Packages
Integrated Circuit
LM22671MRE-ADJNOPB
Small Outline Packages
Integrated Circuit
JFE150DCKT
SOT23 (5-Pin)
Integrated Circuit
ISO7820LLDWW
Small Outline Packages
Integrated Circuit
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”