SMS-135-01-G-D SAMTEC Connector (Other) In Stock

The SMS-135-01-G-D from Samtec is a 70-position dual-row through-hole micro socket with 0.050" x 0.100" pitch and gold-over-nickel contact finish. It offers reliable board-to-board mating in a compact 1.75" body length for high-density interconnect applications. Available from authorized distributors with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SMS-135-01-G-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
70
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 70 positions in a dual-row through-hole layout with 0.050" x 0.100" pitch for high-density signal routing
  • Gold over nickel contact finish (20 µin Au over 50 µin Ni) providing robust mating reliability and corrosion resistance
  • 1.75 inch body length in a compact 0.22 inch x 0.335 inch cross-section for space-constrained PCB designs

Applications

The SMS-135-01-G-D is used in high-density backplane and daughtercard interconnect assemblies where 70 signals must be routed through a compact 0.050" x 0.100" pitch socket. It is well suited for test-and-measurement equipment, embedded computing modules, and industrial control boards that require reliable through-hole mating with gold-plated contacts. The socket also supports prototyping applications where removable module connections are needed without sacrificing signal integrity.

Specifications

Pbfree CodeYes
YTEOL9.15
Additional FeatureTIGER BUY
Body Breadth0.22inch
Body Depth0.335inch
Body Length1.75inch
Body/Shell StyleSOCKET
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (20) OVER NICKEL (50)
Contact Finish TerminationGold (Au) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact Resistance10
Contact StyleBELLOWED TYPE
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insertion Force-Max2.224N
Insulator ColorBLACK
Insulator MaterialGLASS FILLED POLYESTER
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.1inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing2.54mm
Plating Thickness20u inch
Rated Current (Signal)5.2A
Reference StandardUL, CSA
Terminal Length0.1inch
Terminal Pitch1.27mm
Termination TypeSOLDER
Total Number of Contacts70
Withdrawl Force-Min1.668N
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

SMS-135-01-G-D Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and what pitch does the SMS-135-01-G-D support?

The SMS-135-01-G-D is a 70-position dual-row through-hole socket with a 0.050" x 0.100" pitch, enabling high-density signal interconnection in compact PCB layouts for embedded computing and instrumentation applications.

For a test fixture requiring 70 removable signal connections, how does the gold contact finish on SMS-135-01-G-D ensure long service life?

The contacts are finished with 20 µin gold over 50 µin nickel, providing excellent corrosion resistance and low contact resistance across thousands of mating cycles, making the SMS-135-01-G-D suitable for test fixtures with repeated insertion and removal.

What are the body dimensions of SMS-135-01-G-D and how do they affect PCB routing?

The SMS-135-01-G-D has a 1.75 inch body length, 0.22 inch breadth, and 0.335 inch depth. Its compact cross-section allows tight PCB routing even in space-constrained backplane designs, and the through-hole mounting style provides strong mechanical retention.

When would SMS-135-01-G-D be a better choice than a surface-mount connector for a backplane application?

Through-hole connectors like the SMS-135-01-G-D provide significantly higher pull-out force than surface-mount alternatives, making them preferable in backplane assemblies subject to mechanical stress during repeated card insertions, vibration environments, or when handling 70 signals at 0.100" pitch row spacing.

Related Guides

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy