SMS-114-02-G-D SAMTEC Connector (Other) In Stock
SMS-114-02-G-D is a 28-position dual-row through-hole micro socket connector from SAMTEC with 0.050" x 0.100" pitch, gold (20 µin) over nickel contact finish, and Tiger Buy rapid availability for high-density board-to-board interconnects. From $2.10, in stock, worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- SMS-114-02-G-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28-position dual-row layout at 0.050 x 0.100 inch pitch delivers high-density board-to-board connectivity in minimal PCB footprint
- Gold (20 µin) over nickel (50 µin) contact plating ensures durable low-resistance mating across thousands of insertion cycles
- Through-hole mounting provides superior mechanical retention and vibration resistance compared to surface-mount socket alternatives
- Tiger Buy designation guarantees rapid stocking and short lead times for uninterrupted production procurement
- RoHS-compliant lead-free construction meets modern environmental regulations for industrial, medical, and consumer electronics
Applications
The SMS-114-02-G-D is designed for high-density daughter-card, module-to-motherboard, and test fixture interconnects in embedded computing, instrumentation, and industrial control systems where a 0.050" x 0.100" pitch micro socket maximizes contact density in limited PCB space. Its through-hole construction provides robust mechanical retention suitable for connectors subject to repeated mating cycles in laboratory test equipment, robotic controllers, and avionics module interfaces. The 28-position dual-row configuration supports simultaneous power, ground, and signal routing in compact mixed-signal PCB assemblies.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.15 |
| Additional Feature | TIGER BUY |
| Body Breadth | 0.22inch |
| Body Depth | 0.335inch |
| Body Length | 0.7inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (20) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 10mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | 2.224N |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 20u inch |
| Rated Current (Signal) | 5.2A |
| Reference Standard | UL, CSA |
| Terminal Length | 0.19inch |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 28 |
| Withdrawl Force-Min | 1.668N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating does the SMS-114-02-G-D use, and how does 20 µin gold compare to standard 10 µin gold connectors in longevity?
The SMS-114-02-G-D uses gold (20 µin) over nickel (50 µin) contact plating, providing twice the gold thickness versus standard 10 µin gold connectors. The thicker 20 µin gold layer extends wear resistance to over 500 mating cycles without significant increase in contact resistance above 20 mΩ, making it better suited for frequently mated test fixtures, removable modules, and production test sockets than 10 µin gold variants that may expose the nickel barrier earlier under repeated use.
How does the 0.050 x 0.100 inch pitch of the SMS-114-02-G-D enable higher contact density than standard 0.100 x 0.100 inch pitch connectors?
At 0.050 x 0.100 inch pitch, the SMS-114-02-G-D places contacts at half the row-to-row spacing of standard 0.100 inch pitch connectors, achieving 28 contacts in a footprint of approximately 0.7 x 0.22 inches versus 1.4 inches width for a comparable 0.100 inch pitch 28-position socket. This 50% width reduction is critical in high-density PCB designs such as FPGA daughter cards, CPU modules, and test fixture interfaces where connector real estate is at a premium.
Why does through-hole mounting make the SMS-114-02-G-D more suitable than SMD sockets for applications subject to mechanical stress?
Through-hole mounting of the SMS-114-02-G-D anchors contact tails 0.335 inch deep into the PCB, distributing mating forces across the full board thickness rather than just the solder pad surface. This provides dramatically higher pull-out and lateral force resistance versus SMD socket alternatives, making it appropriate for industrial robotic arms, automotive test fixtures, and avionics modules where connector mating under vibration, shock, or misalignment forces would lift or crack SMD pads and cause field failures.
What procurement advantage does the SAMTEC Tiger Buy designation provide for the SMS-114-02-G-D in production environments?
Tiger Buy designation means SAMTEC stocks the SMS-114-02-G-D as a high-availability catalog item, typically with a 1-week or less delivery lead time versus 8–20 weeks for custom or non-stocked connector variants. For production environments assembling 28-position dual-row micro socket boards in volume, this guarantees supply continuity and eliminates the need for large safety-stock orders, enabling just-in-time procurement with reduced inventory carrying cost across the manufacturing supply chain.
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