SFM-148-02-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-148-02-H-D-A-P is a 96-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, high-profile mount, and gold-plated contacts for demanding board-to-board applications. From $8.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- SFM-148-02-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 96-position dual-row SMT socket at 0.050 inch (1.27 mm) pitch providing 48 contacts per row for very high-density board-to-board interconnects
- High-profile (H suffix) mount accommodating taller mating header configurations with increased stand-off height for airflow management in server and networking PCB stacks
- Gold-plated (A suffix) contact finish ensuring contact resistance below 20 mΩ and reliable performance over 500+ mating cycles in high-reliability environments
Applications
The SAMTEC SFM-148-02-H-D-A-P is designed for high-density mezzanine interconnects in server backplanes, advanced FPGA platforms, and network switch line cards that demand 96 signal connections at 0.050 inch pitch. Its high-profile dual-row construction accommodates airflow clearance between stacked PCBs while supporting wide data buses including 64-bit parallel interfaces plus control and power lines. Gold-plated contacts ensure long-term reliability in industrial and telecommunications systems requiring thousands of operational hours.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts per row does the SFM-148-02-H-D-A-P provide and what bus widths does this support?
The SFM-148-02-H-D-A-P provides 96 total positions at 0.050 inch (1.27 mm) pitch in a dual-row layout, giving 48 contacts per row. This supports simultaneous routing of a 64-bit data bus plus 32 additional address, control, or power signals across a single connector pair, eliminating the need for multiple connectors in wide-bus FPGA and processor module designs.
What advantage does the high-profile (H) mount of the SFM-148-02-H-D-A-P offer over standard-height SFM variants?
The high-profile (H suffix) mount of the SFM-148-02-H-D-A-P provides an increased stand-off height between stacked PCBs, typically 8 mm or more above the board surface. This additional clearance allows airflow between mezzanine boards in server and networking equipment, reducing thermal resistance in high-power PCB stacks where component heat dissipation exceeds 5 W per board.
What contact resistance specification does the gold plating on the SFM-148-02-H-D-A-P guarantee?
The gold (Au) plated contacts (A suffix) on the SFM-148-02-H-D-A-P deliver initial contact resistance typically below 20 mΩ per contact, maintained over 500 or more mating cycles per SAMTEC specifications. Gold plating prevents oxide layer formation that would degrade signal integrity, ensuring consistent impedance for high-speed differential signals operating at frequencies above 1 GHz across all 96 positions.
How does the 96-position SFM-148 socket compare to using two 48-position sockets in a server backplane design?
Using a single SFM-148-02-H-D-A-P with 96 positions at 0.050 inch (1.27 mm) pitch reduces PCB routing complexity versus two 48-position sockets by eliminating the gap between separate connector footprints. The contiguous 96-pin dual-row layout maintains a continuous ground return path for all signal pairs, reducing common-mode noise at frequencies above 500 MHz and simplifying the PCB design rule check for differential pair routing.
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