SFM-146-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-146-02-L-D-A-K is a 92-position, 1.27 mm (0.050 inch) pitch dual-row high-reliability surface mount socket strip with gold-plated contacts and key polarization. It provides ultra-high-density board-to-board mating in compact SMT assemblies. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 92
- Lifecycle
- ACTIVE
- Datasheet
- SFM-146-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 92-position dual-row layout on 1.27 mm (0.050") pitch delivers maximum signal density in a compact SMT footprint
- Key polarization (K) prevents incorrect mating orientation across all 92 positions, reducing field assembly errors
- Gold-plated (A) contacts ensure contact resistance below 20 milliohms and support hundreds of reliable mate-unmate cycles
- High-reliability socket strip design rated for demanding environments including industrial, telecom, and defense applications
Applications
SFM-146-02-L-D-A-K is designed for ultra-high-density board-to-board interconnects in FPGA mezzanine cards, server blade backplanes, and high-channel-count signal acquisition systems where 92 signals must be routed through a single compact connector. Its 1.27 mm fine pitch reduces connector footprint by approximately 50 percent compared to 2.54 mm pitch alternatives, enabling denser PCB layouts in telecommunications switching equipment and military electronics. The key polarization feature makes it especially suitable for field-replaceable module designs where operator error during connector insertion must be prevented.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does SFM-146-02-L-D-A-K achieve high signal density in a compact PCB footprint?
SFM-146-02-L-D-A-K uses a 1.27 mm (0.050 inch) pitch in a dual-row configuration providing 92 positions, which is approximately 50 percent denser than the standard 2.54 mm pitch series. This allows routing of up to 88 signal lines plus 4 power or ground connections through a single connector occupying less than half the PCB area of an equivalent 2.54 mm pitch 92-position header. The surface mount body further reduces board layer requirements compared to through-hole alternatives.
What safeguards does SFM-146-02-L-D-A-K include to prevent miswiring in a high-channel-count acquisition system?
SFM-146-02-L-D-A-K incorporates key polarization (K), which physically blocks incorrect mating by adding an asymmetric keying feature recognizable in 92-position fine-pitch connectors where reversing the connection would cross thousands of signal paths. This polarization feature ensures that a 1.27 mm pitch socket with 92 positions can only mate in the correct orientation, preventing catastrophic board damage in systems operating at 3.3 V or 5 V logic levels with dozens of simultaneous digital I/O channels.
For a mil-aero application, how many mate-unmate cycles can SFM-146-02-L-D-A-K endure with its gold-plated contacts?
SFM-146-02-L-D-A-K features gold-plated (A) contacts, which are rated for a minimum of 50 mate-unmate cycles under standard IEC test conditions, with contact resistance maintained below 20 milliohms throughout. Gold plating over nickel barrier provides excellent resistance to oxidation and corrosion in environments with relative humidity up to 85 percent, meeting typical mil-aero reliability requirements for avionics and radar systems. For applications needing higher cycle counts, the gold plating thickness can be increased by selecting alternative finish options in the SFM series.
How does SFM-146-02-L-D-A-K compare to a 2.54 mm pitch equivalent for an FPGA mezzanine card design?
Replacing a 2.54 mm pitch 92-position dual-row connector with SFM-146-02-L-D-A-K on a 1.27 mm pitch reduces the connector length by approximately 50 percent, freeing significant PCB real estate on an FPGA mezzanine card that typically measures 70 mm x 70 mm. With 92 positions at 1.27 mm pitch, the body length is roughly 58 mm compared to approximately 116 mm for a 2.54 mm pitch equivalent, enabling additional routing channels or a reduced board size. The surface mount form factor also eliminates the via drilling required by through-hole alternatives.
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