SFM-139-T2-FM-D-A SAMTEC Connector (Other) In Stock
The SFM-139-T2-FM-D-A is a high-reliability, dual-row surface-mount socket strip from SAMTEC featuring 78 positions on a tight 0.050" (1.27 mm) pitch. Designed for high-density board-to-board interconnects, it delivers reliable signal integrity in compact PCB layouts. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-T2-FM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78 positions in dual-row configuration on 0.050" (1.27 mm) pitch for high-density PCB designs
- Surface-mount termination style simplifies automated assembly with standard SMT pick-and-place equipment
- High-reliability construction rated for repeated mating cycles in demanding aerospace and industrial environments
Applications
The SFM-139-T2-FM-D-A is used in high-density board-to-board signal interconnect applications including FPGA development boards, test and measurement backplanes, and military-grade embedded computing modules. Its 78-position dual-row layout accommodates buses carrying 39 differential pairs or mixed signal and power lines in a single compact connector footprint. Engineers select this part for applications requiring reliable mating in environments subject to vibration and thermal cycling.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin pitch and total position count of the SFM-139-T2-FM-D-A, and how does that affect routing density?
The SFM-139-T2-FM-D-A uses a 0.050" (1.27 mm) pitch with 78 total positions arranged in 2 rows of 39 pins each, enabling routing of 39 differential pairs within a connector footprint of roughly 50 mm in length, significantly reducing board area versus larger-pitch alternatives.
For which board-to-board or mezzanine applications is the SFM-139-T2-FM-D-A specifically engineered?
This connector targets high-reliability mezzanine board stacking applications such as VME/VPX daughtercards, FPGA I/O expansion boards, and aerospace avionics modules where 78 signals must cross the board boundary within a 50 mm connector span and survive 500 or more mating cycles.
How does the surface-mount termination of SFM-139-T2-FM-D-A simplify manufacturing compared with through-hole alternatives?
Surface-mount pads on the SFM-139-T2-FM-D-A eliminate drilling of 78 through-holes, reducing PCB layer count constraints, cutting bare-board cost, and enabling reflow solder assembly in a single pass alongside other SMT components at standard 260°C peak reflow temperatures.
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