SFM-139-02-L-D-A SAMTEC Connector (Other) In Stock
The SFM-139-02-L-D-A is a 78-position dual-row surface mount socket strip from SAMTEC with 0.050" (1.27 mm) pitch and low-profile configuration. It features gold-plated contacts for high reliability and low insertion loss. Designed for high-density board-to-board interconnects in embedded computing and telecommunications applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- SFM-139-02-L-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 78 positions in a dual-row surface mount low-profile layout on 0.050" (1.27 mm) pitch for maximum contact density
- Gold-plated contact finish ensures low resistance and reliable signal integrity through repeated mating cycles
- Surface mount termination compatible with automated SMT assembly processes, reducing board space versus through-hole alternatives
Applications
The SFM-139-02-L-D-A is used in high-density board-to-board interconnects for embedded computing, FPGA daughterboards, and telecommunications line cards where a 78-position dual-row interface is required. Its 0.050" (1.27 mm) pitch low-profile design enables compact PCB layouts in space-constrained systems such as rack-mount servers and test instrumentation. Engineers select this socket strip when high signal density and reliable mating performance across hundreds of cycles are critical design requirements.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-139-02-L-D-A provide, and what is its pitch?
The SFM-139-02-L-D-A has 78 positions arranged in a dual-row layout at a 0.050" (1.27 mm) pitch. This configuration delivers high contact density in a compact SMT footprint, supporting high-speed signal routing in embedded computing and FPGA module designs.
Which SAMTEC header series mate with the SFM-139-02-L-D-A for board-to-board stacking?
The SFM-139-02-L-D-A is designed to mate with SAMTEC TSM or SFM header series that share the 0.050" (1.27 mm) pitch and dual-row geometry. Proper mating allows a 78-position signal interface between PCBs with stack heights defined by the chosen header series.
What assembly considerations apply when placing the SFM-139-02-L-D-A on a PCB using SMT reflow?
The SFM-139-02-L-D-A's surface mount pads support standard lead-free solder reflow profiles up to 260°C peak. Its 0.050" (1.27 mm) pitch requires precise stencil printing to avoid solder bridges across the 78-position dual-row pads, and optical or X-ray inspection is recommended after reflow to verify joint quality.
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