SFM-137-L2-L-D-A-K SAMTEC Connector (Other) In Stock
The SFM-137-L2-L-D-A-K is a 74-position dual-row high-reliability surface mount socket strip from SAMTEC with 0.050" (1.27 mm) pitch for very high-density board-to-board stacking. It features a low-profile variant with locking polarizing hardware suited to demanding aerospace and defense module interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-L2-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row socket strip at 0.050" (1.27 mm) pitch delivers very high-density board-to-board connectivity in a compact SMT footprint
- High-reliability -A-K locking and polarizing pegs prevent connector unmating under mechanical shock, vibration, and thermal cycling
- Low-profile (-L) mating height minimizes board-to-board separation for ultra-thin stacked module designs in aerospace and medical systems
- Surface mount termination with SAMTEC's precision contact geometry ensures consistent 74-channel electrical performance across the full operating temperature range
Applications
The SFM-137-L2-L-D-A-K is engineered for high-channel-count board-to-board stacking applications in aerospace avionics, defense electronics, and high-performance embedded computing. Its 74-position dual-row low-profile design supports FPGA mezzanine cards, signal processing modules, and data acquisition boards where 74 simultaneous signal paths must be maintained in a minimal board separation distance. The locked and polarized interface ensures reliable connections in environments subject to continuous vibration and wide temperature excursions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-137-L2-L-D-A-K provide and what PCB area does its 0.050" pitch footprint require?
The SFM-137-L2-L-D-A-K provides 74 positions in a dual-row configuration at 0.050" (1.27 mm) pitch, resulting in a connector body length of approximately 37 x 1.27 mm = 47 mm for the dual-row footprint. This allows 74 board-to-board signal connections within a PCB edge area of roughly 47 mm x 2.54 mm, which is less than half the footprint of an equivalent 0.100" pitch connector, making it essential for compact FPGA module and mezzanine card designs.
For a defense avionics computer module subject to MIL-STD-810 vibration testing, how does the -A-K locking on the SFM-137-L2-L-D-A-K protect 74-channel signal integrity?
The -A-K suffix on the SFM-137-L2-L-D-A-K adds polarizing pegs and mechanical locking features that secure the mated connector pair against separation under the vibration and shock profiles specified by MIL-STD-810. Without these retention features, the fine 0.050" pitch contact geometry could experience intermittent opens under high-g shock loads, corrupting critical avionics data buses. The locking mechanism maintains all 74 positions in reliable electrical contact throughout the vibration test duration.
When is the low-profile (-L) variant of the SFM-137-L2-L-D-A-K the right choice over a standard-height SFM socket for an FPGA mezzanine card?
The low-profile (-L) variant of the SFM-137-L2-L-D-A-K minimizes board-to-board separation distance, typically to less than 4 mm stacking height, making it ideal for FPGA mezzanine cards that must fit within a constrained chassis slot height such as a 1U or 2U rack-mount enclosure. Standard-height socket strips would increase the overall module stack height by several millimeters, potentially preventing the assembly from meeting mechanical envelope requirements for 74-channel high-speed signal interfaces.
What sourcing consideration makes the SFM-137-L2-L-D-A-K preferable to multiple smaller connectors for a 74-signal interface in a high-reliability system?
Using a single SFM-137-L2-L-D-A-K to carry 74 signals reduces the number of connector mating events from potentially 3 to 4 smaller connectors down to 1, lowering the probability of mating-related assembly defects and reducing PCB routing complexity. For high-reliability aerospace programs with strict component count budgets and failure mode tracking requirements, minimizing the number of interconnect devices per interface directly improves system MTBF. Single-piece sourcing from SAMTEC also simplifies qualification testing to one connector family.
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