SFM-133-T2-STL-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-T2-STL-D-A-P-TR is a 66-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch for surface-mount applications, featuring surface-mount tail contacts, right-angle orientation, press-fit retention tabs, and tape-and-reel packaging. Designed for rugged high-density SMT daughter-card interconnection. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-133-T2-STL-D-A-P-TR?
- 66-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch enabling ultra-high-density surface-mount receptacle connections for complex multi-signal interfaces
- High-reliability contact design rated for 500+ mating cycles with consistent contact resistance below 20 mΩ for demanding plug-in module applications
- Surface mount tail length (STL) contacts with right-angle (A) orientation allowing horizontal cable or daughter-card mating along the PCB surface plane
- Press-fit retention tabs (P suffix) and tape-and-reel (TR) packaging for automated SMT placement with positional accuracy within ±0.1 mm during reflow
What is SFM-133-T2-STL-D-A-P-TR used for?
The SFM-133-T2-STL-D-A-P-TR is designed for ultra-high-density SMT socket applications in FPGA daughter cards, high-speed memory modules, and complex embedded computing platforms where 66 signals must be reliably interconnected through a right-angle surface-mount receptacle. Its high-reliability friction-mate contact system is particularly valuable in plug-in module architectures used in telecommunications line cards, test and measurement instruments, and military electronics where consistent electrical performance is required across hundreds of mating cycles. The tape-and-reel packaging and press-fit tabs make it ideal for high-volume automated PCB assembly in production environments requiring precise placement of a 66-position connector with right-angle mating orientation.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-133-T2-STL-D-A-P-TR datasheet?
SFM-133-T2-STL-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-133-T2-STL-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the right-angle (A) orientation of SFM-133-T2-STL-D-A-P-TR benefit plug-in daughter card designs?
The right-angle orientation of the SFM-133-T2-STL-D-A-P-TR allows 66-position daughter cards to be inserted horizontally parallel to the motherboard surface rather than perpendicular, reducing the mechanical height of the assembled system by the full daughter-card height and enabling chassis designs with clearances as small as 10 mm above the motherboard. This is critical in 1U rack systems, flat-panel embedded computers, and low-profile industrial controllers where vertical connector stacking would exceed the available chassis height constraints.
For a 66-signal high-speed interface, what signal integrity limitations should designers consider with SFM-133-T2-STL-D-A-P-TR at 0.050" pitch?
At 0.050" (1.27 mm) pitch with 66 positions in a dual-row configuration, the SFM-133-T2-STL-D-A-P-TR introduces contact stub lengths that can cause signal reflections above 1 GHz on unterminated lines, limiting its direct use to signals below approximately 500 MHz without matched impedance termination. For high-speed differential pairs routed through this connector, designers should maintain 100 Ω differential trace impedance, minimize via stubs on the PCB side, and limit total connector-plus-trace stub length to under 5 mm to support data rates up to 1 Gbps through the 66-position interface.
How does the press-fit tab feature on SFM-133-T2-STL-D-A-P-TR improve SMT assembly yield for a 66-position right-angle connector?
The P-suffix press-fit retention tabs on the SFM-133-T2-STL-D-A-P-TR snap into PCB mounting holes before reflow, clamping the 66-position right-angle socket to within ±0.1 mm positional accuracy across the entire connector length while the board transits through the reflow oven at peak temperatures up to 260°C. Without retention tabs, thermal expansion of the PCB substrate during reflow can shift a connector of this size by 0.2 to 0.4 mm relative to its solder pads, causing up to 10% of the 66 SMT tails to miss their pads and require costly rework or board scrap.
When is SFM-133-T2-STL-D-A-P-TR a cost-effective alternative to dedicated backplane connectors for modular system design?
The SFM-133-T2-STL-D-A-P-TR is a cost-effective alternative to high-density backplane connectors when the system design routes 66 or fewer signals between a motherboard and a single daughter card with mating cycles below 200, avoiding the premium cost of backplane connector systems that are engineered for 500 to 2,000 insertions in live-system hot-swap applications. At 0.050" pitch the SFM-133 series can be priced 40 to 70% lower per position than equivalent-count high-density backplane connectors while delivering adequate performance for laboratory instruments, industrial IoT gateways, and embedded computing systems with infrequent module removal.
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