SFM-133-L2-LM-D-A-K SAMTEC Connector (Other) In Stock
The SFM-133-L2-LM-D-A-K is a 66-position dual-row high-reliability socket strip from SAMTEC with 0.050 inch (1.27 mm) pitch, surface mount termination, and low-profile mounting. Designed for dense mezzanine card sockets and board-stacking interconnects in compact, high-performance embedded systems. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-L2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66-position dual-row socket strip at 0.050 inch (1.27 mm) pitch enabling ultra-high-density mezzanine card interconnects
- Low-profile (LM) mounting height minimizes the vertical stack envelope for space-constrained board assemblies
- High-reliability contact design rated for thousands of mating cycles with consistent low contact resistance
- Surface mount termination compatible with automated reflow soldering at standard SMT peak temperatures up to 260 degrees C
Applications
The SFM-133-L2-LM-D-A-K is deployed in compact FPGA mezzanine card sockets, aerospace avionics module interconnects, and industrial computing daughter card assemblies where 66 positions at 0.050 inch pitch with a low-profile mount are essential. Its high-reliability contact design ensures consistent signal integrity across thousands of board insertion cycles in environments subject to vibration and temperature extremes from -55 to +85 degrees C. The low-profile (LM) mounting variant reduces the mated stack height compared to standard SFM series sockets, fitting tightly constrained enclosures where every millimeter of vertical clearance matters.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the SFM-133-L2-LM-D-A-K differ from the SFM-133-L2-H-D-A-K in physical profile?
The SFM-133-L2-LM-D-A-K uses a low-profile (LM) mounting height while the SFM-133-L2-H-D-A-K uses a standard height (H). The low-profile variant reduces the mated stack height by several millimeters compared to the H version, typically reducing overall connector height to under 5 mm above the PCB, making the LM variant preferable when the enclosure or overlying PCB allows less than 8 mm of vertical clearance above the socket mounting surface.
What pin count and pitch does the SFM-133-L2-LM-D-A-K provide, and how does this affect routing density?
The SFM-133-L2-LM-D-A-K has 66 positions in a dual-row layout at 0.050 inch (1.27 mm) pitch, with 33 contacts per row. At 1.27 mm pitch, routing traces between pads typically requires HDI PCB techniques, with trace widths of 0.1 mm or less and spacing down to 0.1 mm between the 66 pads, enabling very high signal density per unit board area.
In which mission-critical applications is the SFM-133-L2-LM-D-A-K high-reliability contact rated for extended service?
This SAMTEC socket strip is specified for aerospace avionics line replaceable units (LRUs), military-grade compute modules, and industrial process controllers where the connector must survive thousands of mating cycles at temperatures from -55 to +85 degrees C. The high-reliability contact design maintains contact resistance below 20 milliohms over the rated mating life, ensuring signal integrity for 66-channel digital or analog interfaces even in high-vibration environments.
What soldering process is required to assemble the SFM-133-L2-LM-D-A-K on a PCB?
The SFM-133-L2-LM-D-A-K uses surface mount termination compatible with standard SMT reflow soldering at peak temperatures up to 260 degrees C, conforming to J-STD-020 MSL classification requirements. All 66 positions can be soldered simultaneously in a single reflow pass, eliminating the need for through-hole drilling. Solder paste stencil design must account for the 1.27 mm pad pitch, typically requiring stencil apertures of approximately 0.6 x 1.0 mm for reliable solder joint formation.
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