SFM-133-02-F-D-A-K SAMTEC Connector (Other) In Stock
The SFM-133-02-F-D-A-K is a Samtec 66-position dual-row high-reliability SMT socket strip with 0.050 inch pitch, designed for ultra-high-density board-to-board mating. It features a gold-plated contact system and compact SMT footprint for demanding signal integrity applications. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-02-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66-position dual-row socket strip at 0.050 inch (1.27 mm) pitch for ultra-high-density board-to-board interconnection
- High-reliability contact design with gold finish ensuring low contact resistance across thousands of mating cycles
- Surface-mount termination for standard SMT reflow assembly in high-density PCB layouts
- Compact footprint accommodating 66 signals in the board area equivalent to a 33-position standard 0.1 inch pitch connector
Applications
The SFM-133-02-F-D-A-K is used in ultra-high-density board-to-board interconnects for FPGA mezzanine cards, high-speed data acquisition modules, and advanced telecom line cards. Its 66-position dual-row layout at 0.050 inch pitch maximizes signal count in the smallest possible PCB footprint, supporting both signal and power routing. The high-reliability contact system sustains signal integrity in demanding RF, digital, and mixed-signal environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the SFM-133-02-F-D-A-K provide, and what pitch does it use for board-to-board mating?
The SFM-133-02-F-D-A-K provides 66 contacts in a dual-row arrangement at 0.050 inch (1.27 mm) pitch, delivering one of the highest contact densities in the Samtec SFM series. This high density suits FPGA mezzanine cards and data acquisition boards needing maximum signal count in minimal board area.
How does the SFM-133-02-F-D-A-K compare to smaller SFM variants for high-channel-count designs?
Compared to the 12-position SFM-106 or 36-position SFM-118, the SFM-133-02-F-D-A-K offers 66 positions — more than 5 times more connections than the 12-position variant — all at the same 0.050 inch pitch. This makes it preferable for high-channel signal processing, FPGA I/O expansion, and telecom line cards where 66 or more signals must cross a board boundary.
What assembly process does SFM-133-02-F-D-A-K support, and what contact finish does it use?
The SFM-133-02-F-D-A-K uses surface-mount (SMT) termination compatible with standard reflow soldering, and features a gold contact finish for low-resistance, corrosion-resistant mating. The high-reliability contact system maintains stable electrical performance over repeated mating cycles in industrial and communications equipment.
For which high-signal-count FPGA or SoC module interconnects is the SFM-133-02-F-D-A-K well suited?
This connector suits FMC (FPGA Mezzanine Card) style interfaces, high-speed ADC/DAC mezzanine modules, and advanced telecom switch cards where 66 signals at 0.050 inch pitch are needed in a compact SMT socket. Its dual-row layout supports both differential pairs and single-ended signals within a tight 33-column board footprint.
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