SFM-132-T2-H-D-A-K SAMTEC Connector (Other) In Stock
The SAMTEC SFM-132-T2-H-D-A-K is a 64-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface-mount PCB applications. It features tall-body (H) construction and Tiger Eye gold-plated contacts for robust mating in dense board-to-board interconnect designs. Available globally for immediate worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-position dual-row layout at 1.27 mm (0.050 inch) pitch providing 32 contacts per row for high-density SMT interconnect
- Tall-body (H) variant accommodating longer mating pin lengths for board-stacking applications with greater PCB separation
- Tiger Eye contact technology delivering consistent wiping action and low insertion force across extended mating cycles
- Gold-plated mating contacts with nickel diffusion barrier ensuring contact resistance below 20 mΩ over service life
- High-reliability socket strip rated for demanding industrial, defense, and aerospace PCB environments
Applications
The SFM-132-T2-H-D-A-K is designed for high-density board-to-board stacking in embedded processor systems, FPGA development platforms, and military-grade electronics requiring 64 dual-row positions at 1.27 mm pitch with increased mating depth. Its tall-body configuration supports board separation distances larger than standard connectors allow, making it ideal for PCB sandwich assemblies where components on the inner board faces must clear the connector height. The surface-mount format integrates directly into automated SMT workflows for prototype and production volumes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the tall-body (H) designation of the SFM-132-T2-H-D-A-K mean for board-stacking clearance?
The H (tall-body) designation means the SFM-132-T2-H-D-A-K has a taller socket body than standard-height SFM variants, typically increasing the mating engagement depth by 2 mm to 4 mm above the PCB surface. This extra height is critical in board-stacking applications where components mounted on the inner face of the mating PCB require at least 8 mm of vertical clearance between the two boards to prevent mechanical interference during assembly.
How does the 64-position dual-row layout of the SFM-132-T2-H-D-A-K serve FPGA mezzanine expansion designs?
FPGA mezzanine cards that route 60 or more differential pairs, single-ended I/O signals, and power rails benefit from the 64-position SFM-132-T2-H-D-A-K, which provides 32 contacts per row at 1.27 mm pitch in a compact surface-mount footprint. Designs such as FMC (FPGA Mezzanine Card) daughter boards or high-speed signal acquisition modules can assign 32 signal pairs and 16 power-and-ground contacts within a single connector body, simplifying PCB routing and reducing layer count.
When is the SFM-132-T2-H-D-A-K preferred over a lower-position-count SFM connector for rugged electronics?
The SFM-132-T2-H-D-A-K is preferred in rugged electronics when the design requires 64 signals in a single connector to reduce the overall connector count on a PCB, minimizing total solder joint failures under vibration loads per MIL-STD-810 test conditions. Fewer connectors mean fewer mechanical interfaces that can loosen under shock up to 40 g or vibration across 10 Hz to 2,000 Hz, improving the overall system mean time between failures (MTBF) in defense and industrial deployed platforms.
Which soldering process and peak temperature is compatible with the SFM-132-T2-H-D-A-K surface-mount tails?
The SFM-132-T2-H-D-A-K surface-mount termination tails use tin-with-nickel-barrier finish compatible with lead-free SAC305 reflow soldering at peak temperatures up to 260 °C per IPC/JEDEC J-STD-020 profiles. The nickel barrier prevents tin-copper intermetallic diffusion during reflow, maintaining solder joint shear strength above 10 N per contact after aging, ensuring long-term reliability on FR-4 or high-Tg laminate PCBs in thermally stressed environments.
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