SFM-132-L2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-L2-H-D-A-K is a 64-position dual-row high-reliability surface mount socket strip on a 0.050-inch (1.27 mm) pitch, featuring gold-plated contacts and a high (H) profile for board stacking or component clearance applications. Rated at 1 A per contact and operating from -55 °C to +125 °C for demanding aerospace, defense, and industrial interconnect needs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-L2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64 positions (32 per row) on 0.050" (1.27 mm) pitch dual-row layout enabling very high-density 64-channel SMT socket interconnects in minimal board area
- High (H) profile body provides clearance above the PCB surface for component-under-connector routing or mating with elevated header pins
- High-reliability construction with gold-plated contacts maintaining contact resistance below 20 mΩ over 1000+ mating cycles for aerospace and defense applications
- Surface mount termination compatible with reflow soldering up to 260 °C for integration into automated SMT assembly processes
- Dual-row configuration doubles channel density per PCB length compared to single-row alternatives at the same 1.27 mm pitch
Applications
The SFM-132-L2-H-D-A-K is designed for high-density board stacking, mezzanine card interfaces, and daughter-card socket connections in aerospace avionics, military electronics, and advanced industrial computing systems requiring 64-channel socket strips at 0.050-inch pitch. Its high-profile body accommodates elevated header mating parts or routes signal traces beneath the connector body in densely populated PCB layouts. The gold-plated contacts and wide temperature range make it well-suited for reliability-critical applications in satellite payloads, radar systems, and rugged industrial controllers.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and pitch does the SFM-132-L2-H-D-A-K offer for high-density socket interconnects?
The SFM-132-L2-H-D-A-K provides 64 positions arranged in 2 rows of 32 contacts each on a 0.050-inch (1.27 mm) pitch, delivering very high channel density in a compact SMT footprint. Each gold-plated contact is rated at 1 A, making this socket strip suitable for multi-channel signal routing in aerospace mezzanine cards and high-density industrial computing modules.
How does the high (H) profile of SFM-132-L2-H-D-A-K benefit PCB design in stacking and routing-constrained layouts?
The high (H) profile of the SFM-132-L2-H-D-A-K provides additional vertical clearance between the PCB surface and the mating connector interface, enabling signal traces or bypass capacitors to route beneath the 64-pin connector body without design rule violations. This profile also accommodates mating with elevated 0.050-inch pitch headers in stacked board assemblies where the board-to-board gap must exceed 5 mm to 8 mm for thermal or component height reasons.
What mating cycle durability does the SFM-132-L2-H-D-A-K provide for high-reliability aerospace applications?
The SFM-132-L2-H-D-A-K is rated for over 1000 mating cycles with gold-plated contacts maintaining contact resistance below 20 mΩ throughout the connector's service life. This durability meets the requirements of aerospace line-replaceable units (LRUs) and military electronics where 64-position socket connectors at 1.27 mm pitch must withstand frequent board swap operations across an operating temperature range of -55 °C to +125 °C.
How does the dual-row 64-position SFM-132-L2-H-D-A-K compare to a single-row 64-pin socket for space efficiency?
The dual-row 32x2 layout of the SFM-132-L2-H-D-A-K achieves 64-channel connectivity in approximately half the board length of a single-row 64-pin socket at the same 0.050-inch pitch, saving roughly 39 mm of linear PCB real estate. This makes the dual-row configuration the preferred choice for compact avionics boards, satellite payload modules, and ruggedized military handhelds where PCB dimensions are tightly constrained below 100 mm x 100 mm.
Which surface mount reflow soldering parameters apply to the SFM-132-L2-H-D-A-K assembly?
The SFM-132-L2-H-D-A-K supports standard SMT reflow soldering at peak temperatures up to 260 °C, conforming to JEDEC J-STD-020 moisture sensitivity level requirements. The connector body and contact materials are rated to withstand multiple reflow passes on the 1.27 mm pitch SMT footprint, ensuring solder joint integrity in double-sided PCB assembly processes used in high-reliability defense and aerospace manufacturing.
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