SFM-131-L2-LM-D SAMTEC Connector (Other) In Stock
Samtec SFM-131-L2-LM-D is a 62-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch, designed for surface mount applications that require a large number of contacts with precise alignment and strong mechanical retention.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-L2-LM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-131-L2-LM-D?
- 62-position dual-row (31x2) arrangement on 0.050" (1.27 mm) pitch enables very high contact density in a compact SMT footprint
- High-reliability socket design with surface mount termination supports automated reflow soldering for production efficiency
- Low-profile form factor accommodates space-constrained mezzanine and daughter card interconnect designs
What is SFM-131-L2-LM-D used for?
The SFM-131-L2-LM-D is well suited for mezzanine board interconnects, signal processing cards, and FPGA expansion modules where 62 contacts at 0.050" pitch maximize I/O density without exceeding available PCB area. Its surface mount design integrates into automated PCB assembly processes, reducing board-level assembly time and cost. Communications equipment, industrial computing, and medical diagnostic instruments benefit from its combination of high contact count and reliable SMT attachment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-131-L2-LM-D datasheet?
SFM-131-L2-LM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-131-L2-LM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the SFM-131-L2-LM-D have and how are they arranged across the connector?
The SFM-131-L2-LM-D provides 62 contacts in a dual-row (31x2) configuration on a 0.050" (1.27 mm) pitch. This arrangement achieves high signal density for mezzanine cards, FPGA daughter boards, and industrial computing modules while keeping the connector footprint compact.
For a FPGA expansion card requiring many signals, how does the SFM-131-L2-LM-D compare to a 0.100" pitch socket strip?
The SFM-131-L2-LM-D's 0.050" pitch accommodates 62 contacts in roughly half the board length of an equivalent 0.100" pitch strip, freeing PCB space for additional components or routing layers. For FPGA expansion cards with 62 or fewer I/O signals, this size reduction can be critical in rack-mount or embedded computing form factors.
Is the SFM-131-L2-LM-D compatible with automated pick-and-place assembly and standard SMT reflow?
Yes, the SFM-131-L2-LM-D is specifically designed for surface mount technology, supporting automated pick-and-place placement and standard SMT reflow soldering up to 260°C peak. The 62-position dual-row SMT footprint ensures stable positioning during reflow and eliminates the need for through-hole drilling, reducing PCB fabrication cost.
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