SFM-131-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-02-LM-D-A-K is a 62-position, dual-row, high-reliability socket strip at 0.050" pitch with low-profile surface mount design and locking retention. Supports high signal density board-to-board stacking in industrial and embedded computing applications. Available from authorized global distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row 0.050" pitch surface mount socket offers the highest contact count in the SFM low-profile series
- Locking retention mechanism (K suffix) secures all 62 contacts against accidental disconnection in field and factory environments
- Low-profile (LM) design minimizes stacking height for ultra-compact board-to-board mezzanine assemblies
- High-reliability gold-plated contacts rated for thousands of mating cycles in demanding electronic systems
- Dual-row configuration supports mixed signal and ground routing within a single compact 0.050" pitch connector body
Applications
The SFM-131-02-LM-D-A-K is designed for high-density mezzanine stacking in telecom DSP boards, defense electronics, and high-performance embedded computing modules requiring 62 signal paths in a single compact SMT connector. The low-profile design suits slim blade servers and compact carrier boards where vertical stack height must be minimized. Its locking mechanism meets the mechanical retention requirements of aerospace and rugged industrial platforms subject to shock and vibration.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 62-position count of the SFM-131-02-LM-D-A-K support high-bandwidth FPGA-to-DSP interfaces?
With 62 contacts at 0.050" pitch in a dual-row configuration, the SFM-131-02-LM-D-A-K can simultaneously carry 56 signal lines plus 6 ground or power pins in a single connector. This is sufficient to route a 32-bit parallel data bus with separate address, control, and power rails between an FPGA and a DSP processor on adjacent mezzanine boards, avoiding the use of multiple smaller connectors and the associated skew and impedance mismatch problems.
What does the low-profile (LM) designation mean for board stack height in SFM-131-02-LM-D-A-K designs?
The LM designation indicates a reduced insulator height compared to standard SFM variants, enabling a lower board-to-board stack height in mated assemblies. For applications where the mezzanine board must clear a chassis wall or adjacent component at less than 8 mm above the carrier board, the low-profile LM version provides the necessary clearance while maintaining all 62 contacts at the 0.050" pitch. This is critical in 1U telecom blades and slim embedded computing modules.
For a defense electronics program, how does the locking mechanism on SFM-131-02-LM-D-A-K reduce field maintenance risk?
In defense electronics subjected to MIL-STD-810 shock and vibration testing, a 62-position connector without locking can partially unmate under 15G shock loads, causing intermittent failures on any of the 62 signal lines. The K suffix locking mechanism requires a deliberate release force before unmating, ensuring the connector remains fully engaged during operational stress. During field maintenance, the lock also prevents accidental disconnection when technicians work near the connector, reducing the risk of board damage from partial insertion.
How does SFM-131-02-LM-D-A-K compare to a similar-pitch board-to-board connector with 50 positions for signal count versus cost trade-offs?
The SFM-131-02-LM-D-A-K provides 12 additional contacts compared to a 50-position alternative at the same 0.050" pitch, adding roughly 15% more routing capacity for a modest price premium. The extra 12 pins can be allocated to additional power-ground pairs to improve current distribution—at approximately 1 A per contact for 0.050" pitch connectors, 12 extra pins add up to 12 A of additional power routing capacity. This trade-off favors the 62-position part in power-hungry signal-dense mezzanine designs.
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