SFM-126-T2-H-D-A SAMTEC Connector (Other) In Stock

SAMTEC SFM-126-T2-H-D-A is a 52-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch for dense board-to-board and card-to-card mating applications. It features a high-reliability socket design with gold contacts and a surface mount termination style enabling direct reflow soldering. Available with worldwide distribution for fast prototyping and volume production builds.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-126-T2-H-D-AOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
52
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 52-position dual-row socket strip at 0.050" (1.27 mm) pitch delivers a high signal density footprint, reducing the PCB area needed for inter-board connections by up to 50% compared to 0.100" pitch connectors
  • High-reliability socket contact design provides consistent normal force retention across thousands of mating cycles, maintaining stable contact resistance under vibration and thermal cycling
  • Surface mount termination enables reflow soldering in standard SMT assembly lines, eliminating through-hole drilling and wave solder operations for lower manufacturing cost
  • Dual-row configuration accommodates 52 signals in a compact linear footprint, supporting wide data buses, mixed signal/power interfaces, and high-density expansion module connections
  • Gold-finished contacts ensure low and stable contact resistance over the connector life, suitable for high-cycle test fixture and field-replaceable module applications

Applications

The SFM-126-T2-H-D-A is used in high-density card-to-card and board-to-board interconnect applications where 52 signals must be routed through a compact 0.050" pitch surface mount interface, such as FPGA daughter card sockets, memory expansion modules, and backplane mezzanine card designs. Its high-reliability socket contacts make it well suited for test and measurement fixtures where a daughter card must be inserted and removed hundreds of times without contact degradation. The SMT footprint and dual-row layout also appear in compact industrial control modules, communications line cards, and embedded computing platforms where vertical real estate is limited and signal density is a design priority.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-126-T2-H-D-A Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions does the SFM-126-T2-H-D-A provide per row, and what is the total signal count across both rows?

The SFM-126-T2-H-D-A is a dual-row connector with a total of 52 positions, meaning each row carries 26 contacts at a 0.050" (1.27 mm) pitch. This dual-row 52-position layout accommodates wide signal buses such as a 32-bit data bus with address and control lines, or multiple high-speed differential pairs alongside power and ground rails, in a footprint roughly half the length of a single-row 52-position connector.

What advantages does the 0.050" pitch of the SFM-126-T2-H-D-A offer over 0.100" pitch alternatives in PCB layout?

At 0.050" (1.27 mm) pitch, the SFM-126-T2-H-D-A requires approximately 33 mm of board length for its 26-position row, compared to roughly 66 mm for an equivalent 0.100" pitch connector. This halving of linear footprint is significant in high-density designs such as FPGA development boards, SOM carriers, and compact rack-mount modules where connector zones compete with other high-density components for limited PCB real estate.

Is the SFM-126-T2-H-D-A suitable for repeated mating cycles in a test fixture environment, and what contact feature enables this?

Yes, the SFM-126-T2-H-D-A uses a high-reliability socket contact design with gold plating that maintains stable normal force and contact resistance across extended mating cycles. In test and measurement applications where a daughter card under test is inserted and removed potentially hundreds of times, the gold finish prevents oxidation-related resistance increases that would corrupt measurement accuracy on low-voltage signals below 1 V.

How does surface mount termination on the SFM-126-T2-H-D-A affect PCB manufacturing cost compared to through-hole socket strips?

Surface mount termination eliminates the PCB drilling operation required for through-hole pins, reducing drill time and tooling wear on a 52-position connector by removing 52 drilled holes per board. It also allows the connector to be placed and reflowed in the same SMT pass as surrounding ICs and passives, avoiding a separate through-hole wave solder operation that adds process steps, fixture costs, and cycle time — typically saving 5–15% of total PCB assembly cost for boards with mixed through-hole and SMT components.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy