SFM-126-T2-H-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-126-T2-H-D-A is a 52-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch for dense board-to-board and card-to-card mating applications. It features a high-reliability socket design with gold contacts and a surface mount termination style enabling direct reflow soldering. Available with worldwide distribution for fast prototyping and volume production builds.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- SFM-126-T2-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52-position dual-row socket strip at 0.050" (1.27 mm) pitch delivers a high signal density footprint, reducing the PCB area needed for inter-board connections by up to 50% compared to 0.100" pitch connectors
- High-reliability socket contact design provides consistent normal force retention across thousands of mating cycles, maintaining stable contact resistance under vibration and thermal cycling
- Surface mount termination enables reflow soldering in standard SMT assembly lines, eliminating through-hole drilling and wave solder operations for lower manufacturing cost
- Dual-row configuration accommodates 52 signals in a compact linear footprint, supporting wide data buses, mixed signal/power interfaces, and high-density expansion module connections
- Gold-finished contacts ensure low and stable contact resistance over the connector life, suitable for high-cycle test fixture and field-replaceable module applications
Applications
The SFM-126-T2-H-D-A is used in high-density card-to-card and board-to-board interconnect applications where 52 signals must be routed through a compact 0.050" pitch surface mount interface, such as FPGA daughter card sockets, memory expansion modules, and backplane mezzanine card designs. Its high-reliability socket contacts make it well suited for test and measurement fixtures where a daughter card must be inserted and removed hundreds of times without contact degradation. The SMT footprint and dual-row layout also appear in compact industrial control modules, communications line cards, and embedded computing platforms where vertical real estate is limited and signal density is a design priority.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-126-T2-H-D-A provide per row, and what is the total signal count across both rows?
The SFM-126-T2-H-D-A is a dual-row connector with a total of 52 positions, meaning each row carries 26 contacts at a 0.050" (1.27 mm) pitch. This dual-row 52-position layout accommodates wide signal buses such as a 32-bit data bus with address and control lines, or multiple high-speed differential pairs alongside power and ground rails, in a footprint roughly half the length of a single-row 52-position connector.
What advantages does the 0.050" pitch of the SFM-126-T2-H-D-A offer over 0.100" pitch alternatives in PCB layout?
At 0.050" (1.27 mm) pitch, the SFM-126-T2-H-D-A requires approximately 33 mm of board length for its 26-position row, compared to roughly 66 mm for an equivalent 0.100" pitch connector. This halving of linear footprint is significant in high-density designs such as FPGA development boards, SOM carriers, and compact rack-mount modules where connector zones compete with other high-density components for limited PCB real estate.
Is the SFM-126-T2-H-D-A suitable for repeated mating cycles in a test fixture environment, and what contact feature enables this?
Yes, the SFM-126-T2-H-D-A uses a high-reliability socket contact design with gold plating that maintains stable normal force and contact resistance across extended mating cycles. In test and measurement applications where a daughter card under test is inserted and removed potentially hundreds of times, the gold finish prevents oxidation-related resistance increases that would corrupt measurement accuracy on low-voltage signals below 1 V.
How does surface mount termination on the SFM-126-T2-H-D-A affect PCB manufacturing cost compared to through-hole socket strips?
Surface mount termination eliminates the PCB drilling operation required for through-hole pins, reducing drill time and tooling wear on a 52-position connector by removing 52 drilled holes per board. It also allows the connector to be placed and reflowed in the same SMT pass as surrounding ICs and passives, avoiding a separate through-hole wave solder operation that adds process steps, fixture costs, and cycle time — typically saving 5–15% of total PCB assembly cost for boards with mixed through-hole and SMT components.
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