SFM-126-T2-H-D-A SAMTEC Connector (Other) In Stock

What are the key features of SFM-126-T2-H-D-A?

• 52-position dual-row socket strip at 0.050" (1.27 mm) pitch delivers a high signal density footprint, reducing the PCB area needed for inter-board connections by up to 50% compared to 0.100" pitch connectors
• High-reliability socket contact design provides consistent normal force retention across thousands of mating cycles, maintaining stable contact resistance under vibration and thermal cycling
• Surface mount termination enables reflow soldering in standard SMT assembly lines, eliminating through-hole drilling and wave solder operations for lower manufacturing cost
• Dual-row configuration accommodates 52 signals in a compact linear footprint, supporting wide data buses, mixed signal/power interfaces, and high-density expansion module connections
• Gold-finished contacts ensure low and stable contact resistance over the connector life, suitable for high-cycle test fixture and field-replaceable module applications

What is SFM-126-T2-H-D-A used for?

The SFM-126-T2-H-D-A is used in high-density card-to-card and board-to-board interconnect applications where 52 signals must be routed through a compact 0.050" pitch surface mount interface, such as FPGA daughter card sockets, memory expansion modules, and backplane mezzanine card designs. Its high-reliability socket contacts make it well suited for test and measurement fixtures where a daughter card must be inserted and removed hundreds of times without contact degradation. The SMT footprint and dual-row layout also appear in compact industrial control modules, communications line cards, and embedded computing platforms where vertical real estate is limited and signal density is a design priority.

Compliance & Regulatory

Where can I find the SFM-126-T2-H-D-A datasheet?

Official datasheet from SAMTEC

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