SFM-124-T2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-124-T2-H-D-A-K is a 48-position, dual-row, high-reliability socket strip at 0.050" pitch with surface mount T2 termination and locking retention. High-current contact rating supports dense signal and mixed-power interconnects. Available from global distributors for immediate or scheduled delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- SFM-124-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 48-position dual-row 0.050" pitch surface mount socket strip provides 48 contacts in a compact high-density footprint
- Locking mechanism (K suffix) prevents accidental unmating of all 48 contacts in vibration-prone environments
- T2 surface mount termination enables reflow solder assembly compatible with standard lead-free SMT processes
- High-reliability construction rated for extended service life in industrial and aerospace interconnect applications
- Dual-row layout accommodates mixed signal and power routing within a single compact connector body
Applications
The SFM-124-T2-H-D-A-K is applied in high-density mezzanine and board-to-board stacking applications including FPGA co-processor modules, radar and communications DSP boards, and industrial motion controllers requiring 48 reliable signal paths. The 0.050" pitch and locking feature suit aerospace avionics racks and military electronics where connector security and space economy are both mandatory. SMT assembly compatibility supports automated production at electronics manufacturing services.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the locking mechanism on SFM-124-T2-H-D-A-K protect a 48-position connector in a vibrating avionics enclosure?
The K suffix locking mechanism on the SFM-124-T2-H-D-A-K requires a deliberate release action to unmate the connector, preventing vibration-induced partial unmating of any of the 48 contacts. In avionics enclosures subject to 5G to 20G vibration profiles, even partial unmating of a single contact among 48 can cause critical signal loss. The mechanical lock distributes retention force across the full connector body, which at 0.050" pitch spans approximately 60 mm for 24 positions per row.
What is the contact pitch and total body dimensions of the SFM-124-T2-H-D-A-K and why does it matter for FPGA module design?
The SFM-124-T2-H-D-A-K uses a 0.050" (1.27 mm) pitch with 48 positions in a dual-row arrangement, resulting in a connector body length of approximately 30 mm for 24 contacts per row. For FPGA daughter modules that must interface with a host PCIe or VITA carrier board, this compact 48-pin connector reduces the footprint compared to a 0.100" pitch equivalent, freeing board area for I/O and decoupling capacitors within the constrained module outline.
How does the T2 termination style on this socket affect solder joint reliability in thermal cycling applications?
T2 termination on the SFM-124-T2-H-D-A-K refers to a specific foot geometry designed for surface mount reflow soldering that provides compliance against thermal expansion mismatch between the connector body and the PCB. In applications cycling between -40 °C and 85 °C, the T2 foot geometry absorbs CTE-induced strain in the solder joint, reducing the risk of solder fatigue cracking over thousands of cycles. This makes T2 preferable over rigid termination styles in temperature-stressed industrial boards.
When should an engineer select SFM-124-T2-H-D-A-K instead of a similar 48-position 0.100" pitch socket?
An engineer should select the SFM-124-T2-H-D-A-K over a 0.100" pitch alternative when the PCB layout budget restricts connector length to under 35 mm for 48 contacts. At 0.050" pitch, this connector body is roughly half the length of a 0.100" equivalent, enabling denser module designs. The trade-off is tighter PCB routing rules—requiring 8 mil or finer traces—and the need for HDI board processes, which adds cost compared to standard 6-layer boards designed for 0.100" pitch connectors.
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