SFM-122-T2-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-122-T2-S-D-A-P-TR is a 44-position dual-row high-reliability surface mount socket strip with 0.050 inch (1.27 mm) pitch, designed for mezzanine board stacking and daughter-card interconnects. Features precision-formed contacts and tape-and-reel packaging for automated SMT assembly in demanding signal-density applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 44
- Lifecycle
- ACTIVE
- Datasheet
- SFM-122-T2-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 44-position dual-row 0.050 inch (1.27 mm) pitch high-reliability SMT socket strip delivers 22 contacts per row in a compact mezzanine board stacking footprint
- T2 contact option provides extended contact wipe length for improved reliability and lower contact resistance in repeated mate-unmate mezzanine applications
- Tape-and-reel (TR) packaging with SMT termination enables automated high-volume pick-and-place assembly of 0.050 inch pitch socket strips with minimal manual handling
Applications
The SFM-122-T2-S-D-A-P-TR is used in mezzanine board stacking and daughter-card interconnects in telecom, networking switch modules, and embedded computing systems requiring 44 high-reliability signal connections at 0.050 inch pitch. The T2 contact option with extended wipe length makes it suitable for applications where boards may be mated and unmated multiple times during system commissioning or field maintenance. Its SMT surface mount footprint and tape-and-reel packaging support high-volume automated production with consistent placement accuracy.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact position count and pitch does SFM-122-T2-S-D-A-P-TR provide for mezzanine board stacking?
SFM-122-T2-S-D-A-P-TR provides 44 contact positions in a dual-row configuration at 0.050 inch (1.27 mm) pitch, with 22 contacts per row. This compact 1.27 mm pitch socket strip mates with TFM or TSM series headers to form a high-density 44-signal mezzanine board stacking interface in telecom and embedded computing designs.
What does the T2 contact designation on SFM-122-T2-S-D-A-P-TR add over the standard SFM contact?
The T2 designation indicates an extended contact wipe length compared to the standard contact, providing a longer sliding contact path during mating that wipes away surface oxides and debris on the mating pin. This improves connection reliability and reduces contact resistance, making SFM-122-T2-S-D-A-P-TR preferable in 44-position interfaces that undergo repeated insertion and removal during board maintenance or upgrade cycles.
How does SFM-122-T2-S-D-A-P-TR's high-reliability rating affect its suitability for a telecom line card subjected to repeated board swaps?
SAMTEC's SFM high-reliability series is designed for a higher mating cycle life than standard socket strips, with precision contact geometry maintaining consistent normal force and low contact resistance across many insertions. For a 44-position 1.27 mm pitch interface on a hot-swap telecom line card, this means signal continuity is preserved through dozens of board swap cycles — critical for network equipment operating under continuous 24/7 uptime requirements.
For a compact embedded module layout, how does SFM-122-T2-S-D-A-P-TR's SMT footprint compare to a through-hole socket strip at the same pitch?
The SMT footprint of SFM-122-T2-S-D-A-P-TR eliminates the need for 44 through-hole drill pairs, freeing inner PCB routing layers for signal traces and power planes. At 0.050 inch (1.27 mm) pitch, the surface mount pads occupy minimal solder land area, and the connector can be placed on either side of the board — a key advantage for double-sided SMT assembly of high-density embedded computing modules.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”