SFM-122-02-LM-D-A-K SAMTEC Connector (Other) In Stock
The SAMTEC SFM-122-02-LM-D-A-K is a 44-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface-mount PCB applications. It features Tiger Eye gold-plated contacts in a low-profile configuration for dense signal interconnect on embedded modules and daughter cards. Stocked for global availability and immediate worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 44
- Lifecycle
- ACTIVE
- Datasheet
- SFM-122-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-122-02-LM-D-A-K?
- 44-position dual-row layout at 1.27 mm (0.050 inch) pitch enabling 22 contacts per row in a compact SMT footprint
- Tiger Eye contact technology providing reliable wiping action and low insertion force across high-cycle mating
- Low-profile (LM) design minimizing connector height above PCB for thin or stacked board assemblies
- Gold-plated mating contacts with nickel barrier maintaining contact resistance below 20 mΩ over extended service life
- High-reliability socket strip construction rated for industrial, telecom, and aerospace-grade PCB environments
What is SFM-122-02-LM-D-A-K used for?
The SFM-122-02-LM-D-A-K is suited for high-density board-to-board and mezzanine interconnect on FPGA carrier boards, embedded SOM (system-on-module) platforms, and multi-channel sensor interface cards requiring 44 signal positions at 1.27 mm pitch. Its low-profile form factor reduces overall assembly height, benefiting thin embedded enclosures and stacked PCB configurations with tight clearance budgets. The surface-mount footprint integrates directly into standard SMT assembly workflows for both engineering samples and production volumes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-122-02-LM-D-A-K datasheet?
SFM-122-02-LM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-122-02-LM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch does the SFM-122-02-LM-D-A-K provide for mezzanine card interconnect?
The SFM-122-02-LM-D-A-K provides 44 positions in a dual-row configuration at 1.27 mm (0.050 inch) pitch, giving 22 contacts per row. This channel count suits FPGA mezzanine modules, SOM carrier boards, and data acquisition daughter cards that route 40 or more signals across a compact PCB area while maintaining the electrical integrity required for differential signal pairs at hundreds of MHz.
How does the low-profile (LM) variant of the SFM-122-02-LM-D-A-K reduce stack height in embedded assemblies?
The LM (low-profile) designation means the SFM-122-02-LM-D-A-K has a reduced body height above the PCB surface compared to standard-height versions, typically cutting the above-board height by 1.5 mm to 2.0 mm. This reduction matters in stacked embedded enclosures where a clearance budget of 5 mm or less between PCB layers must accommodate the connector body, soldered joint fillets, and any conformal coating applied over the assembly.
For a compact FPGA expansion board needing 44 signals, why use the SFM-122-02-LM-D-A-K over a 50-position alternative?
Selecting the 44-position SFM-122-02-LM-D-A-K over a 50-position connector saves approximately 7.6 mm of board length at 1.27 mm pitch, recovering valuable PCB real estate for decoupling capacitors or power regulation components. When the design pinout requires exactly 44 lines, an oversized 50-position connector wastes 6 unconnected contacts and increases the solder joint count that must pass automated optical inspection, adding to production cost and potential defect risk.
What soldering process is compatible with the SFM-122-02-LM-D-A-K surface-mount termination?
The SFM-122-02-LM-D-A-K uses tin-with-nickel-barrier SMT termination tails compatible with lead-free SAC305 solder paste reflow at peak temperatures up to 260 °C per IPC/JEDEC J-STD-020 profiles. The nickel diffusion barrier prevents tin-copper intermetallic growth during reflow, ensuring reliable solder joints on standard FR-4 PCBs processed through convection reflow ovens on RoHS-compliant production lines.
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