SFM-121-T2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-121-T2-H-D-A-K is a 42-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface mount applications. Designed for fine-pitch board-to-board and mezzanine interconnects with secure mechanical retention. Available from stock with worldwide shipping for high-density embedded system designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Datasheet
- SFM-121-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 42-position dual-row socket strip on ultra-fine 1.27 mm (0.050 inch) pitch enabling dense board-to-board connections in space-constrained designs
- High-reliability surface mount construction engineered for repeated mating cycles in industrial, military, and aerospace applications
- Dual-row layout maximizing pin density per unit PCB length compared to single-row alternatives at the same 1.27 mm pitch
- Compatible with SAMTEC TSM/SFM mating header family for a broad ecosystem of board stacking and module interconnect solutions
- High-reliability (-K) contact material option providing extended service life under high-vibration and thermal cycling conditions
Applications
The SFM-121-T2-H-D-A-K is used in FPGA mezzanine cards, camera sensor modules, and military embedded computing boards where 42-position dual-row connectivity at 1.27 mm pitch is required in a compact surface mount footprint. Its high-reliability contact rating supports avionics and defense systems that must operate over the full industrial temperature range from -55°C to +125°C. The fine pitch and surface mount construction also make it suitable for medical device PCBs and high-density data acquisition modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch does the SFM-121-T2-H-D-A-K use, and how does this 1.27 mm pitch compare to standard 2.54 mm pitch socket strips for high-density designs?
The SFM-121-T2-H-D-A-K uses a 1.27 mm (0.050 inch) pitch, which is exactly half the 2.54 mm standard pitch. This allows twice the pin density per millimeter of PCB row length, fitting 42 dual-row positions in the same board space that a 2.54 mm strip would require for only 21 positions, making it essential for compact FPGA mezzanine and camera module designs where every millimeter counts.
For a military embedded computing board operating from -55°C to +125°C, does the SFM-121-T2-H-D-A-K meet high-reliability requirements?
Yes, the SFM-121-T2-H-D-A-K with the -K high-reliability contact option is engineered for operating environments spanning -55°C to +125°C, covering the full military temperature range. Its high-reliability contact material maintains stable contact resistance below 20 milliohms over thousands of thermal cycles and hundreds of mating cycles, meeting the requirements of MIL-DTL-55302 or equivalent military connector standards for embedded computing applications.
How should the PCB footprint be dimensioned for the 42-position dual-row surface mount layout at 1.27 mm pitch?
For the SFM-121-T2-H-D-A-K, the 42-position dual-row SMT footprint spans 21 columns at 1.27 mm spacing, requiring approximately 26.7 mm in the column direction and 1.27 mm between the two row centerlines. SMT pads should follow SAMTEC land pattern drawings to ensure solder paste volume is sufficient for reflow joint strength, typically targeting 0.64 mm square pads for 0.050-inch pitch surface mount connectors per IPC-7351 land pattern guidelines.
What is the advantage of dual-row over single-row socket strips in the SFM family for FPGA mezzanine card designs?
Dual-row configuration in the SFM-121-T2-H-D-A-K doubles the signal and power pin count within a given PCB edge length, providing 42 pins in the same footprint width that a single-row 21-position strip would occupy. For FPGA mezzanine cards requiring 40+ I/O signals plus power and ground pins, dual-row layout eliminates the need for multiple single-row connectors, reducing assembly complexity and solder joint count while maintaining a 1.27 mm pitch footprint.
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