SFM-119-T2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-119-T2-H-D-LC-TR is a 38-position, dual-row, 0.050" pitch surface-mount socket strip with high reliability and low-current contacts. The 2x19 configuration with tape-and-reel packaging supports automated SMT assembly processes.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- SFM-119-T2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 38-position dual-row 2x19 layout at 0.050" (1.27 mm) pitch enables dense signal routing in compact spaces
- Low-current (LC) contact variant optimized for signal-level connections in sensitive analog and digital circuits
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place assembly with consistent placement accuracy
Applications
The SFM-119-T2-H-D-LC-TR is designed for high-density daughter card and mezzanine board interconnects in embedded computing, test instrumentation, and telecommunications equipment. With 38 positions at 0.050" pitch, it enables compact multi-signal routing in FPGA daughter boards, signal conditioning modules, and data acquisition systems that require reliable, low-profile surface-mount connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-119-T2-H-D-LC-TR provide, and what is the row configuration?
The SFM-119-T2-H-D-LC-TR provides 38 total positions arranged in a dual-row 2x19 configuration at 0.050" (1.27 mm) pitch, making it suitable for high-density board-to-board signal interconnects requiring up to 38 separate lines.
What does the LC designation mean in SFM-119-T2-H-D-LC-TR, and in which circuits is it most appropriate?
The LC designation indicates a low-current contact rating, typically rated for signal-level currents well below 1 A per pin. This variant is most appropriate for digital logic, analog signal, and data bus connections rather than power delivery, such as in FPGA I/O headers, sensor interface boards, and communication backplanes.
For a mezzanine module with 36 to 40 I/O lines, why would SFM-119-T2-H-D-LC-TR be chosen over a through-hole alternative?
The SFM-119-T2-H-D-LC-TR offers a surface-mount footprint at 0.050" pitch that saves significant PCB area compared to through-hole 2.54 mm pitch alternatives, accommodating 38 signals in roughly half the board length. Tape-and-reel packaging further reduces assembly cost at volumes above 500 units.
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