SFM-119-L2-H-D-A SAMTEC Connector (Other) In Stock
SFM-119-L2-H-D-A is a SAMTEC 38-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount configuration. It provides fine-pitch, high-density mating for SMT daughter-card and module interconnects requiring secure retention. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- SFM-119-L2-H-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 38 positions in a dual-row layout with 0.050" (1.27 mm) pitch for high-density SMT socket solutions
- High-reliability socket strip construction ensures stable contact resistance across repeated mate/demate cycles
- Surface mount termination enables automated pick-and-place assembly and standard reflow soldering processes
Applications
SFM-119-L2-H-D-A is ideal for daughter-card and mezzanine board interconnect applications in embedded systems, FPGA development platforms, and high-speed communication modules where a 0.050" pitch dual-row socket provides 38 reliable signal paths. The surface mount format supports compact, high-density PCB layouts in instruments and industrial controllers requiring repeatable plug-in module connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of SFM-119-L2-H-D-A compare to standard 0.100" socket strips in high-density board designs?
The SFM-119-L2-H-D-A uses a 0.050" (1.27 mm) pitch, which is half the spacing of standard 0.100" socket strips. In a dual-row, 38-position configuration, this halved pitch reduces the connector footprint by approximately 50% compared to a 0.100" equivalent, allowing designers to route 38 signal connections in the board area that a 0.100" dual-row connector would occupy with only 19 positions.
Which signal integrity characteristics make SFM-119-L2-H-D-A suitable for high-speed data interconnect on FPGA boards?
The SFM-119-L2-H-D-A features a surface mount 0.050" pitch dual-row socket construction with contact stub lengths minimized to reduce impedance discontinuities at signal frequencies above 1 GHz. The 38-position layout can carry multiple differential pairs, and the high-reliability contact design maintains low insertion loss across the operating temperature range of -55 °C to +125 °C.
How many signal connections does SFM-119-L2-H-D-A provide and how does that map to a typical module interface?
SFM-119-L2-H-D-A provides 38 signal positions arranged across 2 rows of 19 contacts each at 0.050" pitch. A typical FPGA mezzanine or camera module interface using this socket can carry 16 data lines, 2 clock pairs, power and ground pins, and control signals within the 38-position allocation, making it well suited for module connectors requiring compact SMT footprints and high contact density.
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