SFM-117-T2-S-D-LC-TR SAMTEC Connector (Other) In Stock

SAMTEC SFM-117-T2-S-D-LC-TR is a 34-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch, low-clearance design and tape-and-reel packaging. Engineered for fine-pitch mezzanine and daughter card connections in demanding applications. Available from authorized distributors with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-117-T2-S-D-LC-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
34
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 34-position dual-row surface mount socket strip with 1.27 mm (0.050 inch) pitch for high-density fine-pitch board-to-board connections
  • High-reliability (T2) contact rating withstands demanding mechanical and electrical cycling in aerospace, defense, and industrial environments
  • Low-clearance (LC) profile minimizes board stack height, and tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly

Applications

SFM-117-T2-S-D-LC-TR is designed for high-density mezzanine and daughter-card interconnect applications in military, aerospace, and industrial electronics where reliable 1.27 mm pitch connections are critical. The low-clearance design reduces overall PCB stack height, making it suitable for compact embedded systems, ruggedized computing modules, and test fixture interfaces. Its tape-and-reel packaging supports high-volume automated SMT production environments.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-117-T2-S-D-LC-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pitch and contact count does SFM-117-T2-S-D-LC-TR provide for high-density board connections?

SFM-117-T2-S-D-LC-TR offers a 1.27 mm (0.050 inch) pitch with 34 total positions arranged in a dual-row layout, giving 17 contacts per row. This fine pitch allows high-density interconnection on compact PCBs used in embedded computing, test equipment, and defense electronics where space is limited but pin count requirements are high.

Which high-reliability applications benefit most from using SFM-117-T2-S-D-LC-TR?

The T2 high-reliability contact rating makes SFM-117-T2-S-D-LC-TR suitable for aerospace avionics, military ground systems, and industrial control modules that require connectors surviving hundreds of mating cycles at elevated temperatures. Its surface mount form factor with low-clearance (LC) option reduces PCB stack height by several millimeters compared to standard-profile socket strips, benefiting ruggedized compact assemblies.

How does tape-and-reel packaging of SFM-117-T2-S-D-LC-TR support volume manufacturing?

The tape-and-reel (TR) suffix indicates SFM-117-T2-S-D-LC-TR is packaged on carrier reels compatible with standard 8 mm or 12 mm pick-and-place feeders, enabling automated placement at throughputs exceeding thousands of parts per hour. This eliminates hand-placement labor costs and reduces placement errors in high-volume SMT assembly lines for communications, defense, and computing hardware.

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
$
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy