SFM-117-02-L-D-DS SAMTEC Connector (Other) In Stock
SAMTEC SFM-117-02-L-D-DS is a 34-position, dual-row, high-reliability surface-mount socket strip on 0.050 inch pitch. It features beryllium copper contacts with 10 µin gold over 50 µin nickel mating finish and polarized housing. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 36
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-02-L-D-DS Datasheet PDF
- Category
- Connector
- Price
- From $5.6800(MOQ 250)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 34-position dual-row surface-mount layout on ultra-fine 0.050 inch (1.27 mm) pitch for high-density board interconnects
- Beryllium copper contacts with 10 µin gold over 50 µin nickel mating finish for low-resistance, high-cycle durability
- Polarized socket housing prevents reverse mating on fine-pitch arrays, reducing assembly defects in automated SMT lines
- Matte tin over nickel barrier termination finish ensures reliable soldering to standard reflow profiles
Applications
The SFM-117-02-L-D-DS is engineered for high-density board-to-board and mezzanine applications in telecommunications, embedded computing, and test instrumentation where the 0.050 inch pitch maximizes connector density per unit area. Its beryllium copper contacts and gold mating finish support thousands of mating cycles, making it ideal for removable daughter card and FPGA module sockets. The polarized surface-mount housing integrates seamlessly into automated SMT assembly processes, lowering production costs for high-volume industrial electronics.
Specifications
| YTEOL | 9.4 |
| Additional Feature | POLARIZED |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | BERYLLIUM COPPER |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 34 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact material and plating does SFM-117-02-L-D-DS use, and how many mating cycles can it reliably support?
The SFM-117-02-L-D-DS uses beryllium copper contacts plated with 10 µin (0.25 µm) gold over 50 µin (1.27 µm) nickel on the mating surface. This combination provides low contact resistance typically below 20 milliohms and is rated for hundreds to thousands of mating cycles, making it appropriate for removable module sockets in test fixtures and field-replaceable embedded computing boards.
For a high-density FPGA daughter card, how many signal lines can this 34-position dual-row connector carry?
With 34 total positions in a dual-row configuration, the SFM-117-02-L-D-DS provides 17 contacts per row on a 0.050 inch (1.27 mm) pitch, supporting up to 34 independent signal or power lines per connector. Designers can carry multiple high-speed differential pairs at data rates up to several Gbps alongside 3.3 V or 5 V power rails, all within the compact SMT footprint suited to compact FPGA module edge connections.
When should an engineer select SFM-117-02-L-D-DS over a wider-pitch 0.100 inch socket strip?
The 0.050 inch pitch of the SFM-117-02-L-D-DS occupies roughly half the PCB area of an equivalent 0.100 inch connector, a critical advantage when board real estate is constrained in portable instruments, telecommunications blades, or compact embedded systems. Its surface-mount termination also eliminates through-hole drilling, reducing board manufacturing cost by up to 30% in dense multilayer designs where drill registration becomes a yield concern.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 250+ | $7.1900 | $1797.50 |
| 500+ | $6.8200 | $3410.00 |
| 1000+ | $5.6800 | $5680.00 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”