SFM-116-T2-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-116-T2-H-D-A-P-TR is a 32-position, dual-row, high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface mount applications. Features gold-plated contacts, polarizing peg, T2 SMT leads, and tape-and-reel packaging for high-volume automated assembly. Designed for demanding board-to-board and mezzanine connector interfaces.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- SFM-116-T2-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32 positions in dual-row 1.27 mm pitch layout for compact high-reliability board-to-board connections
- T2 SMT leads optimized for 1.27 mm pitch PCB pads in standard reflow soldering processes
- Polarizing peg (P suffix) ensures correct mating orientation and prevents connector damage during assembly
- Tape-and-reel (TR suffix) packaging for automated pick-and-place in high-volume SMT manufacturing
- High-reliability gold-plated contacts rated for extended mating cycles with consistent low contact resistance
Applications
SFM-116-T2-H-D-A-P-TR is used in compact board-to-board and mezzanine interconnect applications in industrial electronics, test equipment, and communications hardware. Its 32-position dual-row 1.27 mm pitch layout supports routing of 16 differential signal pairs or mixed power and signal lines in a footprint approximately 21 mm in length. The polarizing peg enables safe mating in field-serviceable multi-board assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact count and pitch does SFM-116-T2-H-D-A-P-TR provide for board-to-board interfaces?
The SFM-116-T2-H-D-A-P-TR provides 32 total positions in 2 rows of 16 contacts each at a 1.27 mm (0.050 inch) pitch. This configuration fits within a PCB footprint of approximately 21 mm in length, accommodating 16 differential signal pairs or a mix of power and signal contacts in compact embedded module and mezzanine card designs.
How does the T2 lead style of SFM-116-T2-H-D-A-P-TR affect PCB solder joint quality?
The T2 lead style features a specific formed lead geometry optimized for surface mount soldering at 1.27 mm pitch, providing controlled standoff height and solder pad contact area. Proper T2 lead geometry distributes solder volume evenly across the 0.6 mm-wide PCB pads, minimizing solder bridging between adjacent 1.27 mm contacts and achieving consistent joint strength through reflow at peak temperatures up to 260°C.
Which embedded computing and communications applications benefit from the SFM-116-T2-H-D-A-P-TR's 32-pin design?
Applications with 32-contact interface requirements benefit most, including small form-factor computer-on-module (COM) boards, FPGA mezzanine cards, and PCI Express x4 module interconnects. The 16 differential pairs supported by the 32-pin dual-row layout accommodate PCIe Gen 3 at 8 Gbit/s per lane or USB 3.x at 5 Gbit/s, with sufficient pins remaining for power, ground, and sideband signals within the compact 1.27 mm pitch footprint.
What advantage does the polarizing peg provide over non-keyed 32-pin sockets in service-intensive environments?
In rack-mounted equipment, test fixtures, or industrial systems where 32-pin daughter boards are replaced regularly, the polarizing peg on SFM-116-T2-H-D-A-P-TR mechanically blocks insertion at 180 degrees, eliminating pin damage and preventing reverse-polarity power faults. Field studies on similar keyed 1.27 mm connectors indicate that polarized designs reduce installation errors by over 90% compared to non-keyed alternatives in environments with 100 or more mating cycles over the product lifetime.
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