SFM-113-L2-LM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-L2-LM-D-LC-TR is a 26-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch in surface mount configuration with low-crosstalk shielding. Designed for high-speed board-to-board signal interconnects demanding exceptional signal integrity. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-L2-LM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row socket strip at 0.050" (1.27 mm) pitch for space-efficient high-density designs
- Low-crosstalk (LC) shielding reduces electromagnetic interference between adjacent signal pins
- Surface mount termination supports automated pick-and-place PCB assembly
- High-reliability contacts for demanding telecommunications and computing applications
Applications
The SFM-113-L2-LM-D-LC-TR is designed for high-speed digital interconnect applications in advanced computing, telecommunications, and instrumentation platforms. Its 26-position dual-row 0.050" pitch layout with low-crosstalk shielding is ideal for mezzanine card stacking, FPGA module interconnects, and multi-gigabit signal routing on space-constrained boards. Defense and aerospace electronics designers also specify this part for its robust reliability and signal integrity at fine pitch.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does SFM-113-L2-LM-D-LC-TR provide and at what pitch?
SFM-113-L2-LM-D-LC-TR provides 26 positions in a dual-row configuration at 0.050" (1.27 mm) pitch, giving 13 pins per row. This compact fine-pitch layout allows 26 high-speed signal or power connections within a very small PCB footprint, making it ideal for mezzanine modules and space-constrained board-to-board interconnect designs in computing and telecommunications equipment.
What role does the LC (low-crosstalk) feature play when SFM-113-L2-LM-D-LC-TR is used in multi-gigabit signal designs?
The LC (low-crosstalk) shielding on SFM-113-L2-LM-D-LC-TR reduces capacitive and inductive coupling between adjacent signal pins in the 26-position 0.050" pitch connector. At multi-gigabit data rates, even small levels of crosstalk can degrade bit error rates significantly. The low-crosstalk shielding structure isolates signal paths, maintaining eye diagram quality and enabling reliable data transmission across all 26 positions.
Is SFM-113-L2-LM-D-LC-TR suitable for use on FPGAs or DSP processor module stacking applications?
Yes, SFM-113-L2-LM-D-LC-TR is well suited for FPGA and DSP module stacking applications due to its 26-position dual-row 0.050" (1.27 mm) pitch and high-reliability socket contacts. The fine pitch allows large numbers of I/O and power pins to connect between a carrier board and compute module within a small 1.27 mm pitch footprint, while the low-crosstalk shielding preserves high-speed signal fidelity.
Does the tape-and-reel format of SFM-113-L2-LM-D-LC-TR support high-volume SMT production?
Yes, the TR suffix on SFM-113-L2-LM-D-LC-TR confirms tape-and-reel packaging optimized for high-volume surface mount production. This format allows continuous automated pick-and-place feeding of 26-position 0.050" pitch socket strip components without manual loading interruptions, improving throughput and reducing handling-related defects in large-scale PCB assembly runs for telecommunications and computing products.
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