SFM-112-T2-L-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-112-T2-L-D-A-P is a 24-position dual-row high reliability surface mount socket strip with 0.050" (1.27 mm) pitch, featuring gold-plated contacts and designed for high-density mezzanine board-to-board stacking in telecom, industrial, and embedded computing applications. Delivers reliable signal integrity with low contact resistance across thousands of mating cycles. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- SFM-112-T2-L-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24-position dual-row layout at 0.050" (1.27 mm) pitch for compact high-density SMT board interconnect
- High reliability socket strip design withstands thousands of mating cycles with consistent contact force
- Gold-plated contacts provide low contact resistance for reliable high-speed signal transmission
- Surface mount termination supports standard SMT reflow assembly and automated pick-and-place processes
Applications
The SFM-112-T2-L-D-A-P is suited for compact mezzanine and daughter-card board stacking in embedded computing, telecom access equipment, and FPGA module interconnects where 24 signal or power connections are needed within a minimal 1.27 mm pitch SMT footprint. Its high reliability design and gold contacts make it a dependable choice for applications requiring repeated mating cycles in industrial test fixtures, hot-swap modules, and field-replaceable boards. The part is also used in medical instrumentation and ruggedized military COTS boards demanding long service life and stable signal integrity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does SFM-112-T2-L-D-A-P use, and how does it support reliable high-speed signals?
SFM-112-T2-L-D-A-P uses gold-plated mating contacts that maintain contact resistance typically below 20 milliohms and provide a stable, oxide-free mating surface through thousands of insertions. This is critical for high-speed differential signals such as LVDS or USB 3.0 pairs routed through the 1.27 mm pitch connector, where contact resistance variation above 30 milliohms can cause impedance discontinuities and signal integrity degradation.
For a compact FPGA daughter card needing 24 connections, how does SFM-112-T2-L-D-A-P compare to a 26-position SFM-113 variant?
SFM-112-T2-L-D-A-P provides 24 positions (2 rows of 12) compared to 26 positions in SFM-113, both at 0.050 inch (1.27 mm) pitch in dual-row SMT format. If your FPGA interface requires exactly 24 signal pins, SFM-112 is the better fit as it avoids 2 unused contacts and the slightly shorter body length saves approximately 2.5 mm of PCB edge space in compact daughter-card designs where every millimeter matters.
Can SFM-112-T2-L-D-A-P be used in industrial test fixtures subjected to repeated mating cycles over the equipment's lifetime?
Yes, the SAMTEC SFM series high reliability socket strips are designed to withstand hundreds to thousands of mating cycles while maintaining contact resistance below 30 milliohms. In industrial test fixtures that may mate and unmate 5 to 10 times daily, SFM-112-T2-L-D-A-P provides years of reliable service with gold contacts resisting fretting corrosion and maintaining spring force, unlike lower-grade tin-contact alternatives that degrade after 50 to 100 cycles in open-air environments.
What assembly process is recommended for SFM-112-T2-L-D-A-P, and does it require special solder paste or temperature profiles?
SFM-112-T2-L-D-A-P is a surface mount component compatible with standard lead-free SMT reflow soldering using no-clean or water-washable solder paste. The recommended reflow peak temperature is typically 260°C with a time above liquidus of 30 to 60 seconds per IPC-7711/7721 guidelines. No special solder paste formulation is required; standard SAC305 alloy is appropriate, and the 1.27 mm pitch pad layout is readily supported by standard PCB design tools and stencil fabrication processes.
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