SFM-110-02-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-110-02-LM-D-A-P is a 20-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch, featuring beryllium copper contacts with 10 µin gold over 50 µin nickel mating finish and polarized housing for error-free mating.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- SFM-110-02-LM-D-A-P Datasheet PDF
- Category
- Connector
- Price
- From $1.9600(MOQ 1000)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-110-02-LM-D-A-P?
- 20-position dual-row socket with 0.050" (1.27 mm) pitch for high-density SMT board-to-board connections
- Beryllium copper contacts with 10 µin gold over 50 µin nickel mating finish for superior conductivity and wear resistance
- Polarized housing prevents incorrect mating orientation, reducing assembly errors in production
- Matte Tin (Sn) with Nickel (Ni) barrier termination for reliable solder joint integrity during reflow
- Female contact gender designed to mate with standard .050" pitch pin headers for modular system assembly
- High reliability socket strip rated for demanding industrial and communications interconnect applications
What is SFM-110-02-LM-D-A-P used for?
SFM-110-02-LM-D-A-P is designed for high-reliability board-to-board interconnect in industrial control systems, telecommunications equipment, and embedded computing modules where compact 0.050 inch pitch sockets with keyed mating are required. The polarized housing and beryllium copper contacts make it particularly suited for field-replaceable module designs and high-cycle mating applications in instrumentation and data acquisition systems.
What are the specifications of SFM-110-02-LM-D-A-P?
| YTEOL | 9.4 |
| Additional Feature | POLARIZED |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | BERYLLIUM COPPER |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA |
Where can I find the SFM-110-02-LM-D-A-P datasheet?
SFM-110-02-LM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-110-02-LM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why does SFM-110-02-LM-D-A-P use beryllium copper contacts instead of phosphor bronze?
Beryllium copper contacts provide higher spring force, better electrical conductivity, and superior fatigue resistance compared to phosphor bronze. This makes the SFM-110-02-LM-D-A-P more reliable over thousands of mating cycles. The 10 µin gold over 50 µin nickel mating finish further reduces contact resistance in high-cycle applications.
How does the polarized housing on SFM-110-02-LM-D-A-P prevent assembly errors in production?
The polarized housing design physically prevents the connector from being inserted in the wrong orientation, eliminating incorrect mating that could damage the 20 contacts or the connected PCB signals. This feature is especially valuable in high-volume SMT assembly environments and field-replaceable module designs where misalignment risk must be minimized.
What termination finish does SFM-110-02-LM-D-A-P use and why does it matter for SMT soldering?
The termination finish is Matte Tin (Sn) with a Nickel (Ni) barrier layer. Matte tin is compatible with standard lead-free reflow soldering profiles peaking around 260°C, while the nickel barrier prevents tin diffusion into the copper contact, ensuring long-term solder joint reliability for surface mount assembly.
What is the pitch and contact count of SFM-110-02-LM-D-A-P, and how does it fit compact PCB designs?
The SFM-110-02-LM-D-A-P uses 0.050 inch (1.27 mm) pitch with 20 total positions in a dual-row layout. This fine pitch configuration enables a significantly smaller board footprint compared to 0.100 inch pitch connectors, making it well suited for space-constrained embedded modules, mezzanine cards, and compact instrumentation boards.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1000+ | $3.3700 | $3370.00 |
| 2500+ | $2.6700 | $6675.00 |
| 5000+ | $1.9600 | $9800.00 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
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