SFM-109-T2-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-109-T2-H-D-A-P-TR is an 18-position dual-row high-reliability SMT socket strip on 0.050 inch pitch, designed for fine-pitch mating with high-density headers in space-constrained PCB designs. Supplied in tape-and-reel format with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- SFM-109-T2-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.050 inch (1.27 mm) fine pitch enables high-density interconnects in space-constrained PCB layouts
- 18-position dual-row socket configuration provides 18 mating points in a minimal footprint
- High-reliability socket contact design ensures consistent mating force across repeated insertions
- Surface mount termination supports automated reflow assembly compatible with standard SMT processes
- Tape-and-reel (TR) packaging enables high-volume automated pick-and-place production
Applications
The SFM-109-T2-H-D-A-P-TR is suited for high-density board-to-board and module-to-carrier interconnects in portable electronics, medical devices, and aerospace subsystems where 0.050 inch pitch maximizes pin count per unit area. Its high-reliability contact rating makes it appropriate for equipment subjected to vibration or thermal cycling. The SMT format and tape-and-reel packaging allow seamless integration into automated production lines for consumer and industrial electronics.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch does the SFM-109-T2-H-D-A-P-TR use, and why is this important for high-density designs?
The SFM-109-T2-H-D-A-P-TR uses a 0.050 inch (1.27 mm) pitch, which is half the standard 0.100 inch pitch. This finer pitch allows twice the pin density in the same PCB footprint area, critical for compact assemblies in wearable electronics, satellite modules, and dense FPGA carrier boards.
How does the high-reliability socket design of the SFM-109-T2-H-D-A-P-TR benefit repeated mating cycles?
The high-reliability contact geometry maintains consistent normal force across repeated insertions, typically rated for hundreds of mating cycles while keeping contact resistance below specified limits. This durability suits field-serviceable modules, test fixtures, and plug-in daughter cards that must be seated and removed multiple times over the product life.
What assembly process is compatible with the SFM-109-T2-H-D-A-P-TR, and how is it supplied for manufacturing?
The SFM-109-T2-H-D-A-P-TR uses surface mount termination compatible with standard reflow solder profiles with peak temperatures around 260°C and is supplied in tape-and-reel (TR) packaging. The TR format feeds directly into automated pick-and-place equipment, supporting high-volume SMT assembly lines without manual handling.
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