SFM-107-L2-H-D SAMTEC Connector (Other) In Stock

SFM-107-L2-H-D is a 14-position dual-row, high-reliability surface-mount socket strip from SAMTEC with 1.27 mm (0.050 inch) pitch and gold-plated contacts for superior signal integrity. Designed as a female board connector, it enables reliable PCB-to-module mating in compact high-density assemblies. Its tight pitch and gold contact finish make it ideal for telecom, aerospace, and high-cycle interconnect applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-107-L2-H-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
14
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 14-position dual-row layout at 1.27 mm (0.050 inch) pitch for high-density surface-mount interconnection
  • Gold contact finish on both mating and termination surfaces for low contact resistance and high corrosion resistance
  • High-reliability socket strip design supporting frequent mating cycles in test and serviceability applications
  • Compact 0.505 × 0.185 inch body enabling space-efficient PCB integration in dense board-to-board designs

Applications

SFM-107-L2-H-D is used in high-density board-to-module and daughter-card interconnection schemes in telecom line cards, aerospace avionics, and high-performance computing where 1.27 mm pitch sockets provide reliable mating with matching header pins. Its gold contact finish ensures consistent low-resistance connections across thousands of mating cycles, making it suitable for hot-swap modules, test fixtures, and field-replaceable units. The surface-mount dual-row configuration also enables tight board layouts in portable instrumentation and medical devices requiring compact 14-pin interconnects.

Specifications

Pbfree CodeYes
YTEOL9.4
Body Breadth0.145inch
Body Depth0.185inch
Body Length0.505inch
Body/Shell StyleSOCKET
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD
Contact Finish TerminationGold (Au) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialBERYLLIUM COPPER
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing2.7178mm
Rated Current (Signal)3.2A
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts14
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

SFM-107-L2-H-D Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact pitch and row configuration does SFM-107-L2-H-D use, and how many total contacts does it provide?

SFM-107-L2-H-D uses a 1.27 mm (0.050 inch) pitch in a dual-row female socket configuration, providing 14 total positions (7 per row). This compact pitch enables high-density PCB-to-module connections in applications where standard 2.54 mm pitch connectors would consume twice the board space, making it ideal for telecom modules, small form-factor PCBs, and embedded computing daughter cards.

Why does SFM-107-L2-H-D's gold contact finish matter for high-cycle-count interconnects in test equipment?

SFM-107-L2-H-D features gold (Au) plating with a nickel (Ni) barrier on both the mating and termination surfaces, providing corrosion resistance and stable contact resistance across thousands of insertion and extraction cycles. In test fixtures and hot-swap modules where connectors may be mated and unmated hundreds of times, gold finish prevents oxidation-induced resistance drift that would compromise signal integrity at the 14-position, 1.27 mm pitch interface.

How does SFM-107-L2-H-D's surface-mount package affect PCB assembly compared to through-hole socket strips at the same pitch?

As a surface-mount component with a 0.505 × 0.185 inch body footprint, SFM-107-L2-H-D is compatible with standard SMT reflow soldering, eliminating the need for wave soldering or hand-insertion steps required by through-hole equivalents. This reduces assembly time and cost in high-volume PCB manufacturing while enabling placement on both sides of the PCB, maximizing layout flexibility for dual-row 1.27 mm pitch interconnects in compact multi-layer board designs.

Which board-to-board or module-to-carrier applications most benefit from SFM-107-L2-H-D's high-reliability socket construction?

SFM-107-L2-H-D is best suited for applications requiring repeated mating such as plug-in RF modules, daughter cards in telecom chassis, memory expansion sockets, and field-replaceable units in avionics or industrial computers. Its dual-row 14-position layout at 1.27 mm pitch provides 14 signal or power contacts in a 0.505 inch length, enabling dense yet reliable interconnection in systems where connector failure or intermittent contact would cause costly downtime.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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CTO, AutoDrive Systems, Italy