SFM-106-L2-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-106-L2-SM-D-A-P is a 12-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount assembly. Provides a compact, solderable interface for board-to-board and mezzanine card connections. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- SFM-106-L2-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12 positions in a dual-row surface mount 0.050" (1.27 mm) pitch layout enabling compact high-density PCB interfaces
- High-reliability SMT termination with gold-plated contacts rated for consistent low insertion-force mating over 200+ cycles
- Low-profile SMT solder tail configuration compatible with standard reflow soldering for automated PCB production
Applications
The SFM-106-L2-SM-D-A-P serves as a reliable interconnect for compact mezzanine modules, daughter cards, and small embedded computing boards requiring 12 signal pins at 0.050" pitch. Its dual-row configuration doubles pin density versus single-row alternatives, fitting into space-constrained areas of FPGA carrier boards and wireless communication modules. The surface mount format integrates seamlessly into high-volume reflow assembly processes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can the SFM-106-L2-SM-D-A-P carry and what is its per-contact current rating?
The SFM-106-L2-SM-D-A-P provides 12 positions in a dual-row layout at 0.050" (1.27 mm) pitch, supporting up to 1 A per contact at voltages up to 125 V AC/DC. This makes it suitable for mixed signal and low-voltage power rails commonly found in FPGA daughter cards, sensor modules, and wireless board stacks where compact 12-pin interfaces are needed.
For a compact IoT module, why would a designer choose SFM-106-L2-SM-D-A-P over a single-row 6-position connector?
Choosing the SFM-106-L2-SM-D-A-P over a single-row 6-position connector at the same 0.050" pitch reduces the required board edge length by 50% while maintaining 12 signal paths. In a dual-row configuration the connector body spans only about 0.30 inch in length, leaving more PCB space for RF shielding or battery circuitry in space-constrained IoT and wearable designs.
What mating header family is recommended for use with the SFM-106-L2-SM-D-A-P to achieve a complete 12-position board-to-board stack?
The SFM-106-L2-SM-D-A-P is designed to mate with SAMTEC TFM or TSM series terminal strips at 0.050" pitch with a dual-row 6-position-per-row arrangement. Available stacking heights range from approximately 3 mm to 15 mm, allowing designers to select the correct board separation for their particular mezzanine stack-up while maintaining reliable 12-pin electrical continuity.
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