SFM-106-02-H-D-A-K SAMTEC Connector (Other) In Stock
The SFM-106-02-H-D-A-K is a 12-position dual-row high-reliability surface mount socket strip from SAMTEC with 0.050" (1.27 mm) pitch for dense board-to-board interconnects. It features tall stack height, locking hardware, and precision contacts for demanding aerospace and industrial applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- SFM-106-02-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row socket at 0.050" (1.27 mm) pitch provides high-density board-to-board mating in minimal PCB footprint
- High-reliability construction with -A-K locking and polarizing pegs prevents accidental unmating under shock and vibration loads
- Tall stack-height (-H) variant accommodates board separation requirements in multi-layer sandwich PCB assemblies
- Surface mount termination enables automated reflow assembly, reducing hand-soldering labor for 12-position dual-row footprints
Applications
The SFM-106-02-H-D-A-K is designed for high-reliability board-to-board stacking interconnects in aerospace avionics, military electronics, and ruggedized industrial control systems. Its 0.050" pitch dual-row layout packs 12 signal connections into a compact SMT footprint, supporting space-constrained module designs where board real estate is limited. The locking polarizing hardware ensures secure mating in environments subject to mechanical shock, vibration, and thermal cycling.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height does the -H suffix provide on the SFM-106-02-H-D-A-K and which PCB assembly styles benefit?
The -H suffix on the SFM-106-02-H-D-A-K designates a taller mating height, providing increased board-to-board separation typically in the range of 8 mm to 12 mm depending on the specific variant. This accommodates sandwich PCB assemblies where components on the lower board must clear the upper board, which is common in compact embedded computer modules, mezzanine card designs, and multi-layer avionics sub-assemblies requiring component clearance between stacked boards.
For a 12-signal avionics module subject to 15 g vibration loads, how does the SFM-106-02-H-D-A-K maintain connection reliability?
The SFM-106-02-H-D-A-K's -A-K suffix provides polarizing pegs and locking features that mechanically retain the mated connector pair against separation forces, maintaining all 12 circuit connections under sustained vibration loads up to and exceeding 15 g. Without these retention features, the 0.050" pitch dual-row interface could experience intermittent contact opens under high-g mechanical environments, causing avionics data bus errors or power interruptions critical to flight safety.
How does the SFM-106-02-H-D-A-K's 0.050" pitch compare to 0.100" pitch socket strips for a space-constrained drone flight controller?
The SFM-106-02-H-D-A-K at 0.050" (1.27 mm) pitch places 12 dual-row positions in approximately half the board area required by an equivalent 0.100" pitch socket strip. For a drone flight controller where every square millimeter of PCB space affects weight and form factor, this density advantage enables more signal connections per unit area. The 0.050" pitch SMT format also supports lighter and thinner PCB stackups compared to through-hole 0.100" alternatives.
What production cost advantage does the SMT format of the SFM-106-02-H-D-A-K provide over through-hole board-to-board connectors in volume manufacturing?
The SFM-106-02-H-D-A-K's surface mount termination eliminates the need for drilled through-holes in the PCB, reducing fabrication cost by simplifying the board stackup. In volume production runs of 10,000 or more units, SMT placement via pick-and-place machines handles the 12-position dual-row connector at the same throughput as any other SMT component, whereas through-hole connectors require a separate wave soldering or hand-soldering step that adds 0.05 to 0.20 USD per connector in labor and process cost.
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